Test, Analysis & Reliability
The working group “Test, Analysis & Reliability” supports the technical communication between industry, research institutions and educational institutions in the fields of electrical and physical analysis, modeling as well as verification of the reliability and lifetime determining properties of individual components and systems. In addition to the targeted transfer of knowledge, the focus is also on the networking of experts.
With the help of the open technical exchange, the working group thus initiates impulses for methodology and device development between users and developers. In addition to these subject-specific aspects, the working group is also concerned with engineering and science-specific training and the further training of specialists in the field.
WORKING GROUP LEADER
Prof. Dr. rer. nat. Michael Beck
Brandenburgische Technische Universität
+49 3573 85 523
michael.beck@b-tu.de
WORKING GROUP LEADER
Prof. Dr.-Ing. Daniel Kriesten
Fraunhofer Institute for Electronic Nano Systems ENAS
Hochschule Mittweida
+49 371 45001 332
daniel.kriesten@enas.fraunhofer.de
Goals:
- Exchange of experience and networking of regional and national experts
- Exchange on new developments in methodology and device development between users and developers
- Modeling and simulation of physical-technical fundamentals and lifetimes of discrete and integrated electrical assemblies
- Exchange on manufacturing sections such as assembling / packaging, test equipment and test programs.
Target group of the working group
- Experts and professionals from industry, research and education
Added value of the working group
- Bundling of singular competencies in educational and research institutions
- Professional exchange
- Targeted networking/matchmaking
- Development of new methodologies
- Support for device development
Review
Topics from the past few months
- Thermal Reliability in Experiment and Simulation
- Advanced Packaging & Analysis
