Microelectronics

GlobalFoundries: Accelerating the introduction of co-packaged optics for modern AI data centers with the SCALE optical module solution

May 4, 2026. GlobalFoundries (Nasdaq: GFS) (GF) today announced the launch of its SCALE™ optical module solution for co-packaged optics (CPO). GF’s SCALE solution, short for Silicon Photonics Co-Packaged Advanced Light Engine, is the industry’s first platform compatible with the Optical Compute Interconnect Multi-Source Agreement (OCI MSA) and exceeds the requirements of the OCI MSA optical interconnect specification for modern scalable AI architectures.

Share this Post

Contact info

Silicon Saxony

Marketing, Kommunikation und Öffentlichkeitsarbeit

Manfred-von-Ardenne-Ring 20 F

Telefon: +49 351 8925 886

redaktion@silicon-saxony.de

Based on GF’s advanced silicon photonics technology, the SCALE-CPO solution leverages both coarse and dense wavelength division multiplexing (CWDM, DWDM) for bidirectional data transmission over any fiber, achieving significant improvements in bandwidth density and system scalability over traditional copper links. GF has already demonstrated 8λ- and 16λ-bidirectional DWDM natively on its platform – a fundamental technology milestone that puts GF in a unique position to support the industry shift to CPO and accelerate the adoption of optical scale-up interconnects.

GF’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully qualified photonic devices, such as 50 Gbps and 100 Gbps microring modulators, coupled ring resonators and integrated photodiodes. Other features include through-silicon vias (TSVs) for high-speed signal transmission and power supply, and copper pad pitches from 110 μm to under 45 μm for 2.5D/3D stacking of organic substrates on silicon interposers, enabling customers to quickly move from design to volume production. The platform integrates electrical ICs on advanced single-digit nodes, enabling optimization between best-in-class computing power and state-of-the-art optics without compromising performance. While GF offers multiple approaches to fiber connectivity, the SCALE solution leverages broadband, removable fiber with flat insertion loss across the entire CWDM spectrum to enable future-proof scaling from 4λ in each direction to 8λ and beyond, while ensuring serviceability and testability of known-good-dies for next-generation AI interconnects.

“With over a decade of innovation and manufacturing expertise in silicon photonics technology, GF is poised to unlock the future of high-bandwidth, energy-efficient connectivity with our SCALE solution for co-packaged optics,” said Mike Hogan, Chief Business Officer at GF. “Already today, our technology is exceeding the requirements of the OCI MSA, demonstrating our close collaboration with industry leaders and the readiness of our technology to scale next-generation AI infrastructure. “

About GF 

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors that enable AI at scale from the cloud to the physical world. Through close partnerships with customers, GF delivers differentiated, energy-efficient, high-performance solutions for automotive, aerospace and defense, data centers, smart mobile devices, the Internet of Things and other high-growth markets. With global manufacturing facilities in the US, Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented global team focuses on safety, durability and sustainability every day. 

– – – – – –

Further links

👉 www.gf.com  

Photos: GlobalFoundries

You may be interested in the following

Contact info

Silicon Saxony

Marketing, Kommunikation und Öffentlichkeitsarbeit

Manfred-von-Ardenne-Ring 20 F

Telefon: +49 351 8925 886

redaktion@silicon-saxony.de