Applied Materials partners with SCREEN to bring advanced wafer cleaning technologies to EPIC Center

As semiconductor devices become increasingly complex, precise wafer surface cleanliness has become a critical factor for yield, device performance and reliability at the most advanced process nodes. Any defects that arise during the deposition, etching and material modification steps must be addressed with ever-increasing precision, making jointly optimized cleaning solutions an essential part of the development of next-generation materials engineering technologies.

By combining Applied’s deep process expertise in deposition, dry etch and material modification with SCREEN SPE’s industry-leading cleaning, wet etch and surface preparation capabilities, the two companies can jointly develop optimized, end-to-end process solutions that help chipmakers achieve higher yields and faster time-to-market for next-generation devices.

“The EPIC Center is designed to dramatically accelerate the commercialization of next-generation semiconductor technologies by bringing customers and partners from across the semiconductor ecosystem together in one location and fostering collaborative innovation,” said Dr. , president of Applied Materials. “SCREEN SPE’s wet etch and surface preparation capabilities are closely intertwined with virtually every process step in chip manufacturing. By bringing our technologies together at the EPIC Center, we can jointly develop optimized process solutions that address the increasingly complex surface engineering challenges our customers face as they move to the next technological frontier.”

“SCREEN SPE and Applied Materials have a long history of technical collaboration, and we are proud to deepen that partnership at Applied’s new EPIC Center,” said , President of “As equipment structures become more complex and process windows become narrower, the interface between wet etch and cleaning technology and adjacent process steps is more important than ever. Leveraging our cleaning, wet etch and surface preparation technologies at Applied’s EPIC Center enables the evaluation of process-optimized solutions across the entire process flow, supporting higher performance and greater reliability for our customers’ most advanced devices.”

The new partnership builds on a collaboration that includes joint process development work at Applied’s Materials Engineering Technology Accelerator (META) Center in , where single wafer cleaning systems have been used to support pre- and post-process cleaning optimization in the film formation, etch and ion implantation workflows. The new EPIC Center collaboration significantly expands the scope and reach of this relationship, enabling the companies’ engineering teams to work closely together to address a broader range of next-generation process challenges with faster learning cycles and more direct integration into Applied’s R&E programs.

Applied’s new EPIC (Equipment and Process Innovation and Commercialization) Center in represents the largest investment in advanced semiconductor equipment research and development to date. Spanning more than 180,000 square feet on Applied’s campus, the center was designed from the ground up to dramatically reduce the time to market for breakthrough technologies – cutting the path from early-stage research to volume manufacturing by up to half. The EPIC center will serve as a collaboration hub where leading chip manufacturers, equipment and material suppliers, and research institutions will work together with Applied’s teams to accelerate the development of next-generation semiconductor technologies. The facility is on schedule to begin operations in 2026.

Forward-Looking Statements

This press release contains forward-looking statements, including statements regarding Applied’s investment and growth strategies, development of new materials and technologies, industry outlook and technology requirements, plans and expectations for the EPIC Center, and other statements that are not historical facts. These statements and the assumptions underlying them are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, among others: the demand for semiconductors and the technological requirements of customers; the ability to develop new and innovative technologies; the ability to acquire and protect intellectual property rights in key technologies; the ability to achieve the EPIC Center’s objectives; and other risks and uncertainties described in Applied’s filings with the Securities and Exchange Commission, including Applied’s most recent Forms 10-K, 10-Q and 8-. Forward-looking statements are based on management’s current estimates, projections and assumptions, and Applied undertakes no obligation to update them.

About Applied Materials

(Nasdaq: AMAT) is the leader in materials engineering solutions that form the foundation for virtually every new semiconductor and advanced display worldwide. The technology we develop is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied Materials, we push the boundaries of science and engineering to deliver material innovations that change the world. 

About 

is a leading manufacturer of wafer processing equipment for the global semiconductor market. SCREEN consistently holds the world’s largest market share* in wafer cleaning equipment and offers a wide range of solutions to support semiconductor manufacturing, including lithography, annealing and measurement/inspection systems. 

– – – – – –

Further links

👉 www.appliedmaterials.com  
👉 www.screen.co.jp/spe/en  

Photo: pixabay