
As today’s CMOS technologies continue to evolve, identifying an effective design migration path has become a pressing need. The need to migrate existing IP to smaller, more advanced geometries is increasingly driven by demands for higher performance, lower power consumption and reduced silicon area. Semiconductor designers must re-verify, adapt or redesign designs to ensure functionality is maintained without compromising the benefits of the target node. Adopting fast, reliable and cost-effective migration strategies is also essential to maintain product lifecycles and meet market commitments while taking advantage of advanced process technologies.
Through expanded collaboration, X-FAB customers gain access to a proven migration methodology powered by Cadence Virtuoso Studio – a next-generation tool that provides a new level of automation for custom IC design and layout migration. The solution enables a fast and straightforward transition between technology nodes, supported by built-in optimization capabilities that help get results right the first time. A successful proof of concept has already demonstrated migration from 180nm to 110nm, with the broader offering covering a range from 1µm to 110nm.
A key element of the joint approach is the tight integration between the Cadence migration environment and X-FAB’s PDKs. While Cadence provides the design migration framework and circuit re-optimization tools, X-FAB brings in-depth process knowledge and device mapping expertise. Customers receive specialized mapping files to enable accurate translation of devices between technologies, significantly reducing complexity while maintaining critical performance parameters.
“With PDK support of Cadence Virtuoso Studio design migration, we enable a smooth transition between technologies for our customers,” said Melanie Wilhelm, Design Technology Manager at X-FAB. “This approach allows us to provide a highly efficient and reliable migration path. The X-FAB engineering team is committed to providing this level of support to help customers remain agile and responsive in an increasingly challenging market environment.”
The collaboration builds on an established relationship between X-FAB and Cadence that spans many areas of electronic design automation (EDA) and now has a specific focus on migration workflows. By aligning methodologies and leveraging complementary expertise, the companies enable their customers to accelerate development cycles and minimize risk.
“Design migration is becoming a strategic priority for semiconductor companies grappling with technology evolution, supply chain issues and geopolitical challenges,” said Ashutosh Mauskar, corporate vice president of the Custom Products Group at Cadence. “Our continued collaboration with X-FAB reflects our shared commitment to delivering robust, scalable solutions that simplify migration and support our customers’ long-term innovation roadmaps.”
Through a combination of advanced automation and silicon-proven process technologies, X-FAB and Cadence help CMOS designers move seamlessly between nodes. The result? Shortened time-to-market, optimized design performance and long-term competitiveness in rapidly changing markets.
Glossary
CMOS – Complementary Metal Oxide Semiconductor
IC – Integrated Circuit
IP – Intellectual Property
PDK – Process Design Kit
About X-FAB
X-FAB is a global foundry group that provides a comprehensive range of specialty technologies and design IP to enable its customers to develop world-leading semiconductor products manufactured at X-FAB’s six wafer fabs in Malaysia, Germany, France and the United States.
With expertise in analog/mixed-signal technologies, microsystems/MEMS, photonics, silicon carbide (SiC) and gallium nitride (GaN), X-FAB is the development and manufacturing partner for its customers, primarily serving the automotive, industrial and medical end markets. X-FAB employs around 4,300 people and has been listed on Euronext Paris (XFAB) since April 2017.
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Further links
👉 www.xfab.com
👉 www.cadence.com
Photo: X-FAB