June 19, 2026. A new partnership for Europe’s largest semiconductor cluster: TSMC, ESMC, and the Technical University of Dresden are joining forces to jointly advance research, secure a skilled workforce, and boost the international visibility of Dresden as a semiconductor hub.
June 19, 2026
TSMC, ESMC, and TU Dresden Deepen Strategic Collaboration and Talent Development
© André Wirsig
Prof. Angela Rösen-Wolff, Vice President for Research and Technology Transfer; Charlie Chiang, Deputy Director of ESMC Fab; Clark Chen, Deputy Director of the TSMC University Program; Dr. Christian Koitzsch, President of ESMC; Prof. Ursula M. Staudinger, Rector of TUD; Prof. Roswitha Böhm, Vice Rector for University Culture and Internationalization; and Prof. Niels Modler, Vice Rector for Education and Lifelong Learning. (from left)
Saxony’s semiconductor industry gathered this week for the Silicon Saxony Days in Dresden. In the days leading up to the event, TSMC, ESMC, and TUD—three key players in the industry—outlined the next steps in their collaboration. Joint research on semiconductor technologies, joint teaching and recruitment programs to secure skilled workers, and greater international visibility and appeal for Dresden as a semiconductor hub: The partners set these goals out in a memorandum of understanding. With this, the world’s largest semiconductor manufacturer TSMC, European Semiconductor Manufacturing (ESMC) GmbH, and the Technical University of Dresden (TUD) are deepening their collaboration and strengthening Dresden’s position as Europe’s largest semiconductor cluster.
Representatives from the world’s largest semiconductor manufacturer, Taiwan Semiconductor Manufacturing Company Limited (TSMC); ESMC in Dresden; the TUD Rectorate; and the TUD Center of Excellence for Innovation, Transfer, and Entrepreneurship (TUD|excite) met on June 4, 2026, at TUD. The goal was to define the partners’ future strategic collaboration.
© André Wirsig
Dr. Christian Koitzsch and Prof. Ursula M. Staudinger sign the memorandum of understanding.
In their letter of intent, the partners outlined joint research projects and the development of joint teaching and recruitment programs that go beyond the already highly successful STIPT program. TUD will administer the joint initiatives. TSMC and TUD have been collaborating on skilled workforce training through the Semiconductor Talent Incubation Program (STIPT) since 2024. The program enables students to spend a six-month semester abroad in Taiwan. With the declaration now signed, the partners are further expanding their collaboration.
Marvin Chang, Director of University Programs and Design Solutions, TSMC: “This MoU reinforces our commitment to fostering talent in the industry and helps establish a framework for collaboration on cutting-edge semiconductor research. By combining the academic strengths of TU Dresden as a university of excellence with our technological leadership, we are demonstrating how industry and academia can work together to solve the most complex scaling and design challenges.”
Christian Koitzsch, President, ESMC: “We aim to advance educational programs and development projects, thereby helping Dresden assume a leading role in European microelectronics. Our focus is on building the talent pipeline and infrastructure—an important step toward supporting the long-term development of key industries in the EU.”
Prof. Ursula Staudinger, Rector of TUD: “As a university of excellence with a strong profile in microelectronics, chip design, and data-intensive technologies, we are working together with TSMC to make a significant contribution to training the skilled professionals that Germany, as a semiconductor hub, urgently needs. To ensure this continues in the future, we are now taking the next step in our partnership with this memorandum of understanding. In this way, we are securing strong collaboration that enables innovation in semiconductor research. It is another important step toward developing Dresden into a center for future technologies in Europe.”
Background: STIPT Program
The Semiconductor Talent Incubation Program Taiwan (STIPT) enables STEM students to combine a six-month semester abroad in Taiwan with exclusive hands-on training at TSMC. The exchange program offers 100 spots per year to interested students. Sixty of these are reserved for students at Saxon universities, while the remaining 40 are intended for students from other federal states. The TUD administers the program on behalf of the Saxon Ministry of Science and, together with the Saxon Science Liaison Office Taiwan, organizes the exchange with partner universities and TSMC in Taiwan.
More information: https://tu-dresden.de/studies/during-studies/study-abroad/programs-and-funding-opportunities/semiconductor-talent-incubation-program
Background: TUD|excite
The Center of Excellence for Innovation, Transfer, and Entrepreneurship (TUD|excite) is an interdisciplinary institution at TUD. It brings together key areas of activity under one roof: the management of patents and other intellectual property rights, support for research-based innovation projects on their path to commercialization, strategic partnerships with companies, support for spin-offs, and education and training in technology transfer-related topics.
More information: https://tu-dresden.de/forschung-transfer/transfer/tud-excite
Contact
Hans-Georg Wagner
Head of Unit excite|INNOVATE
+49 351 463-39774
