Company type
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ProTec Carrier Systems GmbH
Small companies (<50 employees or <10 million annual turnover)
Target markets
Electronics·Machinery and Equipment
Industries
Materials·Technology·Upstream Industry
Portfolio
e-chuck·Electronic·Electrostatic Chucks·Equipment·foils·Micro- / Nanoelektronics·mobile substrate holder·Photovoltaics·Semiconductor Industry·Thin glass·thin glass handling·Transferable ElectroStatic Carrier (T-ESC)·trasfer electrostatic carrier·wafers and foils handling and processing
Certificates
Contact
Stahlwerkstraße 21
57555 Mudersbach
57555 Mudersbach
+49 2745 93200-0
Contact Person
About this member
ProTec® - the world´s leading expert for mobile electrostatic chucking solutions.
Over many years ProTec® has built up an unmatched experience in unique chucking solutions, always to the best benefit of our customers. We create value by enabling processes with fragile, expensive or ultra thin substrate materials on standard customer equipment.
Based on electrostatic forces, we chuck various kinds of substrates, e.g. glass, foil, silicon. The substrate fixation is done solely from the backside, giving access for processing to the entire front side. Warped materials are flattened and kept in position even under temperature impact und vacuum atmosphere.
Our T-ESC Technology, an adhesive-free temporary bonding method, is widely used in the semiconductor and display industry e.g. for ultra thin and fragile wafer handling. The force generated is uniform and can be completely controlled, making it the most stress-free fixture for fragile substrates.
Our customers are industry leaders and worldwide famous research institutes coming from various industries such as compound semiconductor (GaAs, InP, LT, LN, SiC, etc.), Power, MEMS, 3D IC in the field of semiconductor to glass and display applications e.g. cover glass coating, optical bonding and OLED manufacturing.
In contrast to mechanical or vacuum-supported clamping devices electrostatic clamping systems work optimally under temperature up to 400°C and in vacuum environment. The electrostatic clamping technology has proven to be a serious candidate solving following problems:
• Full-area clamping force
• Freely-adjustable force regulation
• Bow elimination
• Edge protection
• No partial occlusion of active surface
• Homogeneous thermal transfer between substrate and substrate holder
• Backside gas cooling technique (BSGC)
• Upside-down deposition
• Adapter function: fixing of several substrates on single substrate holder
• “Sandwich Chucking” with masks
• Customized materials, shapes and sizes
Fully Automated Chucking Unit ACU 3000
Founded in 2008, ProTec® Carrier Systems GmbH is a young company with a high innovative worldwide unique technology for fixing and handling of thin and ultra-thin substrates. ProTec® develops and manufactures own machines as well as customizes mobile and stationary electrostatic clamping devices. A specially developed chucking unit enables, in addition, easy technology integration into existing tools of other manufacturers.
High breakage safety by electrostatic clamping, bow elimination
By means of electrostatic fixing forces substrates like glass, silicon wafer and foil with thickness less than 50 µm can be securely fixed, transported, handled and processed in the field of the display manufacturing, plastic electronics, photovoltaic and semiconductor industry.
