Building on proven technology modules and supported by GF’s design ecosystem and global manufacturing footprint, UX technologies will help customers accelerate the development of AI devices and intelligent systems while striking a balance between performance, power, cost, and delivery requirements.
As intelligence shifts from the cloud to billions of connected devices, developers need semiconductor technologies that combine precise sensing, constant connectivity, and energy-efficient processing within strict power and form factor constraints. The UX family expands GF’s portfolio of differentiated technologies for “Physical AI” and offers customers a scalable path to solutions that enable connected microcontrollers (MCUs), highly integrated sensors, and mixed-signal systems. 40UX offers proven, cost-effective integration for MCUs and always-on edge devices, while 22UX delivers a higher level of performance for analog, sensor, and mixed-signal applications in more complex intelligent systems.
The 40UX platform is optimized for secure, intelligent, and connected microcontrollers and system-on-a-chip (SoC) solutions used in wearables, IoT applications, and wireless connectivity solutions. Based on GF’s 40-nm high-volume platform with long-life eFlash technology—of which more than one million wafers have been shipped to date—the 40UX combines transistors with extremely low leakage current and SRAM, low-noise analog functions, integrated embedded flash memory with a built-in self-test function, and advanced RF capabilities to ensure long battery life, high reliability, and compact form factors. The platform is particularly well-suited for Bluetooth Low Energy (BLE) devices, wireless connectivity products, low-noise sensor interfaces, and other edge computing applications where power consumption plays a critical role.
The 40UX platform is scheduled to enter mass production at GF’s Singapore facility by 2027, with future production planned for the Malta, New York, site. The technology roadmap includes optimizations in the area of embedded processing, such as suitability for high-voltage and noisy applications, Automotive Grade 1 qualification, and enhanced options for embedded non-volatile memory.
For applications requiring a higher degree of analog integration and sensor performance, the 22UX platform offers a 22-nm solution optimized for analog applications, including edge AI, image processing, and mixed-signal systems. The platform combines extremely low-power operation with low-noise analog devices, enhanced device matching, wafer-level RTS (Random Telegraph Signal) noise characterization, bond-ready wafers for advanced 3D integration, and a roadmap for extremely low leakage currents, analog “compute-in-memory” capabilities, and embedded memory functions. The platform is ideally suited for stacked CMOS image sensor readout ICs with 1/f flicker noise and low-noise 3.3-V analog FETs for precise measurements. Thanks to improved device matching and a wider voltage margin, the platform is the optimal choice for cost-optimized mixed-signal SoCs, sensor interfaces, and power-sensitive edge devices that require superior analog performance.
The 22UX platform combines features optimized for analog applications, including ultra-low-power capabilities for exceptional energy efficiency and third-generation fill cells for faster block/module integration at the product level. The platform is industry-compatible and enables easy porting from other bulk CMOS platforms. It was developed using modules proven in high-volume production and GF’s successful 28-nm technology, which has delivered over one million wafers to date. 22UX is manufactured at GF’s state-of-the-art facility in Dresden, with a roadmap in place to expand production to multiple sites across GF’s global footprint.
“Intelligence is increasingly finding its way into the devices that people and businesses rely on every day, creating new demands for power efficiency, precise sensing, connectivity, and cost-effective integration,” said Ed Kaste, Senior Vice President of GF’s CMOS business unit. “Our new UX platform family offers customers a scalable path to developing differentiated products for the intelligent edge, backed by proven technology and GF’s global manufacturing capabilities. By expanding our feature-rich CMOS portfolio with the 40UX and 22UX, we are helping our customers bring the next generation of connected and physical AI systems to market.”
Both platforms are available through GF’s GlobalShuttle™ multiproject wafer program for customer engagement and prototyping, with quarterly shipments planned through 2027.
About GF
GlobalFoundries (GF) is a leading manufacturer of semiconductors that the world relies on in everyday life, at work, and for connectivity. We develop innovative solutions and work closely with our customers to deliver more powerful and high-performance products for the automotive industry, smart mobile devices, the Internet of Things, communications infrastructure, and other high-growth markets. With manufacturing facilities in the U.S., Europe, and Asia, GF is a trusted and reliable partner for customers around the world. Every day, our talented global team delivers results with an unwavering focus on safety, longevity, and sustainability. For more information, visit www.gf.com.
Forward-Looking Information
This press release may contain forward-looking statements that involve risks and uncertainties. Readers are cautioned not to rely on these forward-looking statements. These forward-looking statements are made as of the date of this press release. GF is under no obligation to update these forward-looking statements to reflect events or circumstances after the date of this press release or to reflect actual results, unless required by law.
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