Company type
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Freiberg Instruments GmbH
Small companies (<50 employees or <10 million annual turnover)
Target markets
Electronics·Machinery and Equipment
Industries
Machinery & Equipment·Research & Development·Software
Portfolio
Applications·Biotechnology·Defekt Analytic·Electronic·Environmental Technoloy·Equipment·Medical Technology / Pharma·Metrology·Photovoltaics·Physical Metrology·Semiconductor Industry·Software·Test Equipment
Certificates
Contact
Delfter Str. 6
09599 Freiberg
09599 Freiberg
Contact Person
About this member
Established in 2005 as an university spin off from TU Bergakademie - The University of Resources, Freiberg Instruments devoted the first few years to develop and test a whole family of fast, nondestructive, electrical characterization tools under production conditions, measuring parameters like minority carrier lifetime, photoconductivity and resistivity.
Freiberg Instruments is now one of the world's fastest growing, young and dynamic analytical instrumentation companies with products covering a broad spectrum of applications in fields/industries like Semiconductor, Microelectronics, Photovoltaic, Dosimetry, Medical Research, Luminescence Dating, X-ray diffraction and Material Research.
Freiberg Instruments has taken its commitment to quality to the next level and is now ISO 9001:2015 certified.
Products and Services:
The objective of the company is the development and production of a new family of state of the art contact less and non destructive inline measurement tools for the semiconductor industry and research facilities.
These measurement techniques open for the first time the possibility to measure electrical parameters such as lifetime, diffusion length and mobility of charge carriers with so far not achieved sensitivity. This allows for a combination of high spatial resolution, high measurement speed even at very low injection levels. These unusual combination of properties make the methods ideally suited for inline applications. Again owing to the high sensitivity, it is even possible to expand the measurements to the investigation of thin epitaxial layers as found in device fabrication. A special kind of these techniques allows for contact less, non destructive and topographic investigations of defect properties.
A large variety of semiconductor materials can be investigated. Many processing steps can be followed ranging from the preparation of the starting material till to the final device ready for packaging.
