MicroelectronicsFraunhofer ENAS: Progress for microtechnology – “Innovation Office” opened in RegensburgElectronics | Research & Development | Semiconductors
Smart SystemsHZDR: The intelligent swarm – teamwork is also important for dronesConnectivity | Electronics | Mobility | positioning & localization | Research & Development | Software Development
MicroelectronicsInfineon and Siemens: Collaboration to introduce the AURIX TC4x for the next generation of software-defined vehiclesElectronics | Mobility | Semiconductors
Smart SystemsIBM: Expansion of the AI Accelerator offering and collaboration with AMDArtificial Intelligence (AI) | Electronics | IT
Smart SystemsFraunhofer IPMS: Compact LCOS microdisplay with fast CMOS backplane for high-speed light modulationElectronics | Research & Development
EntrepreneurshipTU Dresden: Inspired by nature: Leaftronics paves the way for biodegradable electronicsEcology & Energy Transition | Electronics | Research & Development | Sustainability
Smart SystemsFraunhofer IWU: Customized heads for 3D printing: How to achieve individual and highly efficient functional integrationElectronics | Forschung & Entwicklung | Research & Development
MicroelectronicsGlobalFoundries and NXP: 22FDX next generation solutions for automotive, IoT and smart mobileElectronics | Mobility | Nanoelectronics | Semiconductors
SoftwareFraunhofer FEP: Digitization of coating processes for high-resolution ultrasonic sensorsDigital Twins | Digitalization | Electronics | Research & Development | Sensor Technology
MicroelectronicsThe billions foregone and their reasons – Intel and ZF/Wolfspeed “postpone” EU Chips Act projectsCleanroom | Electronics | Forschung & Entwicklung | Halbleiter | IC Design | IC Design | Internationalisierung | Internationalization | Nanoelectronics | Packaging | Packaging | Research & Development | Semiconductors | Silicon Saxony | Silicon Saxony | Technological Sovereignty