July 11, 2024. Siemens Digital Industries Software today launched Tessent™ Hi-Res Chain, a new tool designed to address the critical challenges facing integrated circuit (IC) design and manufacturing teams in advanced technology nodes where even minor process deviations can have a significant impact on yield and time to market.
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As IC designs move into more advanced nodes at 5nm and below, they become increasingly susceptible to manufacturing variations that can cause defects and slow yields. For these geometries, traditional failure analysis (FA) methods can require weeks or months of laboratory testing. Siemens’ new Tessent Hi-Res Chain tool solves this problem by quickly providing transistor-level isolation for scan-chain defects. For advanced process nodes, where yield increase relies heavily on chain diagnostics, the new software can increase diagnostic resolution by more than 1.5 times, reducing the need for costly, extensive failure analysis cycles.
“Tessent Hi-Res Chain represents a major step forward in quickly identifying and eliminating yield-limiting factors in advanced IC designs,” said Ankur Gupta, Vice President and General Manager, Digital Design Creation Platform Business Unit, Siemens Digital Industries Software. “By providing unprecedented accuracy and resolution in defect isolation, we enable our customers to accelerate their yield and reduce time to market for innovative semiconductor products.”
By correlating design information and defect data from manufacturing tests with patterns from Tessent’s Automatic Test Pattern Generation (ATPG), Tessent Hi-Res Chain transforms defective test cycles into actionable insights. The solution utilizes layout and cell-aware technology to determine the most likely failure mechanism, logical and physical location of a fault.
Building on Siemens’ market-leading chain diagnostic capabilities, Tessent Hi-Res Chain provides precise fault isolation, even for point defects deep in design control signal networks.
The new solution maintains Tessent’s industry-leading accuracy rate, with over 80 percent of generated reports confirmed by FA processes using Tessent technology. This high level of reliability has made Tessent the preferred solution for yield ramping across multiple technology nodes.
Tessent Hi-Res Chain is part of Siemens’ comprehensive Tessent product family, which provides industry-leading solutions for IC test, functional monitoring and silicon lifecycle management. These tools work together to achieve the highest test coverage, accelerate yield, and improve quality and reliability throughout the silicon lifecycle.
For more information about Tessent Hi-Res Chain and the full range of Siemens IC design and test solutions, visit www.siemens.com/tessent.
Siemens Digital Industries Software supports organizations of all sizes in their digital transformation with software, hardware and services from the Siemens Xcelerator Business Platform. Siemens’ software and comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into sustainable products of the future. From the chip to the complete system, from the product to the process, across all industries. Siemens Digital Industries software-accelerating transformation.
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Photo: Siemens
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