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TU Dresden, IAVT

Company type

Target markets

Electronics Packaging & Assembly·Microelectronics·Microsystems Technology·System Design





Helmholtzstraße 18
01069 Dresden

Contact Person

Prof. Karlheinz Bock
0351 4633 6345

About this member

Main Research Fields of IAVT and ZµP
The main fields of research at the Electronics Packaging Laboratory (German abbrev. IAVT) and the Centre of Microtechnical Manufacturing (German abbrev. ZµP) are the technological procedures of manufacturing electronic units and micro technical systems seen from the angle of increased requirements on the scale of integration, the wiring density and reliability as well as automated manufacturing processes. A further important topic of our work is the analysis and synthesis of complex technological processes with special regard to stochastic influences in semi- and full-automatic production systems.
The basis to work on these fields is the wide range of available technological and diagnostic equipment of the IAVT and the ZµP. Another reason is the longtime experience of the scientists. In addition to that the ZµP is member of a network of competence called “Kompetenznetzwerk Mikrotechnische Produktion” in Germany. Meanwhile the network is based on five additional competence centers at scientific research institutions and a large number of industrial enterprises. It represents research projects which are promoted by the Federal Ministry of Education and Research (BMBF). The network realizes the transfer of knowledge and of technologies out of these projects to the whole German electronics industry.
Beside to the scientific investigations and research projects the ZµP is involved in activities in students’ education of the IAVT, it is responsible for the training of apprentices in “Micro Technology” and it has activities in further education.

Main emphases of both institutions:

  • Bio-compatible electronics packaging
  • Wire bonding and Flip-Chip technology
  • Adhesive technology
  • Quality assurance in electronics
  • SMD assembly
  • Reliability of modules
  • Thick-film technology
  • Modeling, simulation and optimization of production processes
  • Low-emission electronics production
  • Non-destructive inspection

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