Company type
Home | Mitglieder |
KMLT GmbH
Target markets
fälschungssichere Label·Laser Engraving·Laser Fine Cutting·Laser Markable Labels·Laser Marking·Laser Micro Cutting·Laserbeschriften·Lasergravur·Lasermikroschneiden·Lasermikroschweißen·Masken für OLED·Mikrobiegen·Präzisionsschablonen·Precision Stencils·SMD-Schablonen·Solar
Industries
Applications·Micro- / Nanoelektronics
Portfolio
Applications·fälschungssichere Label·Laser Engraving·Laser Fine Cutting·Laser Markable Labels·Laser Marking·Laser Micro Cutting·Laserbeschriften·Lasergravur·Lasermikroschneiden·Lasermikroschweißen·Masken für OLED·Materials·Micro- / Nanoelektronics·Mikrobiegen·other·Präzisionsschablonen·Precision Stencils·SMD-Schablonen·Solar
Certificates
Contact
Freiberger Str. 114
01159 Dresden
01159 Dresden
Contact Person
About this member
Detail of a stencil for wafer bumping (75µm thickness)
The application of the relevant amounts of solder for the components is implemented primarily through the correct selection of the required stencil thickness. This selection is influenced by the basic design rules applicable to the components. A final decision, however, is always in the hands of experienced manufacturing engineers.
Normally, different volumes of the paste can be applied due to the professional design adjustments of the pad structure.
Alternatively stepped stencils can be used. In this case the required solder paste volumes are regulated by partial adjustment of the stencil thickness.
Precision stencils for wafer bumping, BGA, LTCC, Solar
Precision plates above 50µm thick are used for wafer bump stencils. These are processed tension free and to high accuracy in climate controlled conditions with highly accurate laser systems.
SMD stencils, high precision stencils, calibration stencils, masks
Laser micro cutting, SMD stencils, laser marking, laser engraving: for more than 32 years KMLT® has been the specialist for reliable contract manufacturing in the demanding field of precise laser micro processing.
We cut precision parts from a variety of conceivable metals, precious metals and alloys from a material thickness of 0.005mm to 3.0mm.
Our specialization enables cuts with low burr formation and highest accuracy. Depending on the part geometry and material properties, manufacturing tolerances of up to ±3µm are feasible and can be verified by protocol.
We manufacture parts for mechanical watches, spring elements, shielding plates, masks, SMD stencils, fitting rings and precision tube parts of all kinds, both as individual parts and in series.
The range of services and scope of delivery in the field of precision stencils includes:
– Laser micro cutting of SMD metal stencils from special stencil sheet (stainless steel, nickel) up to a thickness of 600µm
– Metal stencils for adhesive application
– Step stencils
– Placement and placement control stencils
– Stencils for wafer bumping
– Special stencils for LTCC, BGA, FinePitch applications
– Printing stencils for solar technology – Special stencils with material thicknesses from 10µm
– Masks for OLED technology and others
– License-free perforations for all common quick clamping systems
– Machine brushing for optimal doctoring processes
– Electropolishing
– Nano-coating
– Edge protection – protection against cuts
– Quick-change frames of various ZelFlex types or VectorGuard®
– Repair and maintenance of ZelFlex frames
– Frames made of aluminum or stainless steel profiles
– Complete frame assembly, covering with gauze and gluing in of stencils
– Application of screen filler and stencil lacquer
– Preparation of a quality report (ScanCheck protocol or measurement protocol)
– Provision of data for 3D paste inspection
– EXPRESS service with same-day delivery
Further information at: www.kmlt.de
SMD stencil
Stencil for BGA/µBGA
These place particularly high demands on the laser equipment and the engineer’s technical know-how.
It is dependent here upon placing the least thermal demand on the material. The results are deformation free stencils with up to several hundred thousand pads.
Special demands on the stencil production need to be considered for semiconductor and hybrid technologies.
By using these precision stencils different substances can be applied in print procedures.
Stencil for solder paste printing for a BGA component
In the case of printing using BGA/μBGA, LTCC, Solar, flip chip technologies and for particular high density stencils, metal foils are used with a material thickness from 20μm.
The production of these stencils, tension free, plane and with very high accuracy, places particularly high demands on our production technology and know-how.
As is true for the wafer bump stencils, the material must be minimally thermally affected in order to produce deformation free stencils with sometimes more than one hundred thousand openings.
Find more information: www.kmlt.de
