Microelectronics

Applied Materials and TSMC partner to accelerate AI scaling at EPIC Center

May 11, 2026. Building on more than 30 years of collaboration, Applied Materials, Inc. today announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies needed for the next era of AI. At Applied’s EPIC Center in Silicon Valley, the companies will collaborate on innovations to advance materials engineering, equipment innovation and process integration technologies designed to deliver energy-efficient performance from the data center to the edge.

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“Applied and TSMC have a long history of intense collaboration based on trust and a shared commitment to driving innovation at the forefront of semiconductor technology,” said Gary Dickerson, president and CEO of Applied Materials. “By bringing our teams together at the EPIC Center, we are strengthening this partnership and accelerating the development of technologies to address the unprecedented complexity driving the chip manufacturing roadmap.”

“As semiconductor device architectures evolve with each new generation, the demands on materials engineering and process integration continue to increase,” said Dr. Y.J. Mii, executive vice president and co-chief operating officer at TSMC. “To address the challenges of AI on a global scale, industry-wide collaboration is required. Applied Materials’ EPIC Center provides an ideal environment to accelerate the readiness of equipment and processes for next-generation technologies.”

As part of the EPIC Center collaboration, Applied and TSMC will work together on materials engineering innovations that target the most critical challenges in scaling advanced logic. Areas of focus include:

  • Process technologies that enable continuous improvements in performance, power efficiency and area across all leading logic nodes to meet the growing demands of AI and high-performance computing
  • New materials and next-generation manufacturing equipment, that enable the precise fabrication of increasingly complex 3D transistor and interconnect structures
  • Advanced approaches to process integration that improve yield, variability control and reliability as devices evolve toward vertically stacked and highly scaled architectures

“The evolution of leading foundry technologies requires a new model for collaboration and innovation,” said Dr. Prabu Raja, president of the Semiconductor Products Group at Applied Materials. “As a founding partner of the EPIC Center, TSMC will gain early access to Applied’s innovation teams and next-generation facilities, helping to accelerate the path from technology development to mass production.”

Applied’s new $5 billion* EPIC Center in Silicon Valley represents the largest U.S. investment to date in advanced semiconductor equipment research and development. The center, which will be operational later this year, has been designed from the ground up to dramatically shorten the time to commercialization of breakthrough technologies – from the early research phase to volume production. For chipmakers, the EPIC Center will enable earlier access to Applied’s R&E portfolio, faster learning cycles and accelerated transfer of next-generation technologies to volume manufacturing in a secure collaborative environment. In addition, the co-innovation programs at the EPIC Center will provide Applied with better multi-node visibility to guide R&E investments while increasing R&E productivity and value distribution.

*Capital spending is expected to increase to approximately $5 billion over time as customer projects ramp up.

Forward-Looking Statements This press release contains forward-looking statements, including statements regarding Applied’s investment and growth strategies, development of new materials and technologies, industry outlook and technology requirements, plans and expectations for the EPIC Center, and other statements that are not historical facts. These statements and the assumptions underlying them are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, among others: the demand for semiconductors and the technological requirements of customers; the ability to develop new and innovative technologies; the ability to acquire and protect intellectual property rights in key technologies; the ability to achieve the EPIC Center’s objectives; and other risks and uncertainties described in Applied’s filings with the Securities and Exchange Commission, including Applied’s most recent Forms 10-K, 10-Q and 8-K. All forward-looking statements are based on management’s current estimates, projections and assumptions, and Applied undertakes no obligation to update them.

About Applied Materials Applied Materials, Inc. 

AMAT is a leader in materials engineering solutions that form the foundation for virtually every new semiconductor and advanced display in the world. The technology we develop is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied Materials, we’re pushing the boundaries of science and engineering to deliver materials innovations that are changing the world.

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Further links 

👉 www.appliedmaterials.com  

Photo: pixabay

Contact info

Silicon Saxony

Marketing, Kommunikation und Öffentlichkeitsarbeit

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Telefon: +49 351 8925 886

redaktion@silicon-saxony.de