Company type
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TE Connectivity – First Sensor AG
Target markets
Bonding·Chip on Board·Flip Chip Technology·Prototyping·Sensors
Industries
Micro- / Nanoelektronics
Portfolio
Aerospace·Bonding·Chip on Board·Electronic·Flip Chip Technology·Medical Technology / Pharma·Micro- / Nanoelektronics·Packaging·Prototyping·Rail / Automotive·Semiconductor Industry·Sensors
Certificates
![TE Connectivity – First Sensor AG](https://cdn.pblzr.de/dacbb27c-1270-4041-b681-e2b95f06f8a1/2023/03/te-connectivity-first-sensor-ag-logo.jpg)
Contact
Grenzstrasse 22
01109 Dresden
01109 Dresden
Contact Person
Thomas Ruf
About this member
MPD GmbH develops and manufactures customised microelectronic systems, components and modules.
For processing semiconductor chips and sensors MPD uses very sophisticated technologies of assembly and packaging and clean room classes from 100 000 up to 100 MPD. We can handle quantities ranging from a few prototypes to small series to up to several million pieces. Our products are used in the automotive, safety and medical industry as well as in the electronic industry.
In addition, MPD develops procedures for new applications and increasingly, in cooperation with partners, its own system solutions for customized applications prior for CMOS camera systems and MEMS.