Through the Chips Venture Forum, we are creating opportunities within the aCCCess framework to bring innovative companies together with investors and potential industry partners. This European project connects and supports the Chips Competence Centers. Initiatives like this help companies gain access to expertise, funding, and partners to fuel their growth.
Access to the forum is provided through the European Chips Competence Centers as well as the networks of the European Innovation Council (EIC) and the European Chip Design Platform (EuroCDP). A total of 62 applications were submitted for the 2026 edition. In a multi-stage process, 43 companies were evaluated by investors. Their approaches range from new materials and manufacturing processes to applications in communications, healthcare, and artificial intelligence.
Last week in Bordeaux, companies presented themselves in 23 live pitches across three thematic sessions. The presentations and accompanying debates combined technical developments with questions regarding market potential, industrial demand, and Europe’s technological autonomy. In doing so, the program addressed key topics in the discussion surrounding the Chips Act 2.0.
The session “Photonics & Computing for AI” focused on how to meet the growing demands for computing power and data transmission in an energy-efficient manner. The session centered on optical data links, integrated photonics, and optical chiplets. Other presentations covered local AI applications, neuromorphic computing, secure data processing, and new storage technologies.
Under the title “Sovereignty” , the session focused on technologies that can strengthen Europe’s industrial capacity to act. These included high-frequency technology, radar, and secure networking, as well as medical sensors, microelectromechanical systems (MEMS), imaging, and laser-based distance measurement using LiDAR. The pitches highlighted specific applications in healthcare, communications, and industry.
The session “Foundations” focused on the fundamentals of semiconductor development and manufacturing. Presentations covered new materials and substrates, solutions for power electronics and cooling, as well as tools for chip design, design automation, and measurement technology. Quantum technologies and electronics for extremely low temperatures rounded out the spectrum.
Throughout both days, brief Table Talks—each lasting about ten minutes—delved deeper into the ideas presented. In a total of 418 one-on-one meetings, startups and investors discussed technical questions, applications, and business models. This direct exchange provided an opportunity to assess market opportunities and discuss potential next steps for financing or collaboration.
The discussions made it clear just how much the startups value the easy access to investors and how grateful they are for this opportunity. Investors took advantage of the opportunity to specifically approach companies and hold exclusive one-on-one meetings. The open, relaxed atmosphere made it easier to get to know one another and created space for personal interaction.
The selection was based on repeated discussions among investors over several months: Digital meetings in June were followed by further online discussions in September and October, as well as in-person meetings in Bordeaux. Each company from the EIC and CCC tracks was evaluated in at least three meetings, with some companies undergoing up to nine. In total, 41 judges from 37 funds submitted more than 200 evaluations. The criteria included investor interest, degree of innovation, differentiation, and positive impact; personal recommendations and written comments were also accepted.
For the upcoming final in Munich, 21 companies from ten countries were selected. Fifteen were nominated through the Chips Competence Centers, with three each coming from the EIC and EuroCDP networks. Germany, France, and Spain are each represented by four companies.
— The German finalists are GeNeXIC, Last Mile Semiconductor, Linque, and SideroGaIn. —
With 16 companies in the pre-seed or seed phase, the selection places a strong emphasis on early stages of development.
The Chips Venture Forum Final will take place on November 11, 2026, as part of Semicon Europe in Munich. In addition to the final pitches, the agenda includes Europe’s investment priorities and the strengthening of industrial value chains. For startups, the event offers opportunities to establish contacts for financing and market access; industrial companies can learn about new technologies and potential development partners. Participation is by invitation only; interested parties can request an invitation from the organizers.
We would like to thank the BLUMORPHO team for organizing the event and for the special setting at the Palais de la Bourse.
Discover all selected companies and their technology profiles
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