MicroelectronicsIntel: Intel’s Cryoprober for Quantum Research is Unlike Any Other ToolCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsX-FAB: Collaboration with IHP to Progress SiGe BiCMOS TechnologyCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer IZM: 360° real-time capture – Using 3D radar sensors to drive autonomously without blind spotsCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer IZM: Fraunhofer, collaborated with Marelli in the development of a pure SiC inverter module for high-performance electric drivesCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
Smart SystemsBosch: Adaptable and efficient – the factory of the futureBig Data | Blockchain | Cloud | Data Security | Digital Twins | Digitization | Edge Computing | Industrial Internet of Things | IT | Machinery & Plant Engineering | Mixed Reality | Neuromorphic Computing | Process Technologies | Quantum Computing | Research & Development | Software Development
SoftwareBosch: Ten years of Industry 4.0Artificial Intelligence | Automation | Big Data | Blockchain | Cloud | Data Security | Digital Twins | Digitization | Edge Computing | Industrial Internet of Things | IT | Machinery & Plant Engineering | Mixed Reality | Neuromorphic Computing | Process Technologies | Quantum Computing | Research & Development | Robotics | Sensors | Software Development | Track & Trace
MicroelectronicsFraunhofer and IBM: Fraunhofer launches quantum computing research platform in GermanyCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer IPMS: “Velektronik” research project creates platform for trusted electronicsCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer IPMS: Economical wireless communicationCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor | Wireless systems
Smart SystemsFraunhofer ENAS: Best Paper Award winner of Smart Systems Integration Conference SSI2021 selectedArtificial Intelligence | Automation | Big Data | Blockchain | Cleanroom | Cloud | Data Security | Digital Twins | Digitization | Edge Computing | Education & Training | Electronics | IC Design | Industrial Internet of Things | IT | Machinery & Plant Engineering | Manufacturing | Mixed Reality | Nanoelectronics | Neuromorphic Computing | New Work | Packaging | Process Technologies | Quantum Computing | Recruiting | Research & Development | Robotics | Semiconductor | Sensors | Software Development | Track & Trace