MicroelectronicsFraunhofer IZM: New connection technology with nanowires sets standards for high-performance electronicsElectronics | Nanoelectronics | Research & Development
Microelectronicsedacentrum: Reliable chips – edacentrum awards EDA Medal 2023 to Dipl.-Phys. JĂĽrgen SchlöffelNanoelectronics | Research & Development | Semiconductors
MicroelectronicsTU Dresden, SMWA and GlobalFoundries: Optimization of chip production through AI – starting signal for joint project LOTSEArtificial Intelligence (AI) | Nanoelectronics | Research & Development | Semiconductors
MicroelectronicsEuropean Commission: Joint Undertaking for Chips established under the European Chip LawCleanroom | Nanoelectronics | Packaging | Promotion | Semiconductors
MicroelectronicsSMWA: Infineon and ten Saxon partners receive funding of 17.7 million eurosForschung & Entwicklung | Mobility | Nanoelectronics | Research & Development | Semiconductor | Semiconductors
MicroelectronicsTU Dresden: Using phosphorus to create innovative optoelectronic componentsForschung & Entwicklung | Nanoelectronics | Research & Development | Semiconductor | Semiconductors
EntrepreneurshipSiltronic: Updated climate targets and joining the RE100 initiativeEcology & Energy Transition | Nanoelectronics | Ă–kologie & Energiewende | Semiconductor | Semiconductors | Sustainability
MicroelectronicsDLR: Simulations of superconductors greatly accelerated – research reveals promising findings for high-tech materialsNanoelectronics | Research & Development | Semiconductors
MicroelectronicsNo chips without masksCleanroom | Electronics | IC Design | Nanoelectronics | NEXT | NEXT | Packaging | Packaging | Semiconductor | Technological Sovereignty
MicroelectronicsThe microelectronics value chainAutomation | Cleanroom | Electronics | IC Design | Mechanical & Plant Engineering | Nanoelectronics | NEXT | Production | Semiconductors