MicroelectronicsDLR: Simulations of superconductors greatly accelerated – research reveals promising findings for high-tech materialsNanoelectronics | Research & Development | Semiconductors
MicroelectronicsNo chips without masksCleanroom | Electronics | IC Design | Nanoelectronics | NEXT | NEXT | Packaging | Packaging | Semiconductor | Technological Sovereignty
MicroelectronicsThe microelectronics value chainAutomation | Cleanroom | Electronics | IC Design | Mechanical & Plant Engineering | Nanoelectronics | NEXT | Production | Semiconductors
MicroelectronicsX-FAB Dresden: Interview with Michael Woittennek, Managing DirectorCleanroom | Electronics | IC Design | IC Design | Nanoelectronics | NEXT | NEXT | Packaging | Packaging | Production | Produktion | Semiconductor
MicroelectronicsEuropean Chips Act: Germany is leading the way. Now it is up to Europe.IC Design | Nanoelectronics | NEXT | Packaging | Semiconductor | Semiconductors | Technological Sovereignty
MicroelectronicsThe right decisions at the right time – How Saxony became Europe’s microelectronics hotspotCleanroom | IC Design | Nanoelectronics | NEXT | Packaging | Semiconductor | Semiconductors
MicroelectronicsGrowth with no end in sight – Saxony’s high technology is soaringCleanroom | IC Design | Nanoelectronics | NEXT | Packaging | Semiconductor | Semiconductors | Technological Sovereignty
MicroelectronicsSAW COMPONENTS: Interview with Steffen Zietzschmann, CEOCleanroom | Electronics | Nanoelectronics | NEXT | Packaging | Production | Produktion | Semiconductor
MicroelectronicsInfineon Dresden: Interview with Raik Brettschneider, Vice President & Managing DirectorCleanroom | Electronics | IC Design | Nanoelectronics | NEXT | Packaging | Production | Semiconductor
MicroelectronicsGlobalFoundries Dresden: Interview with Dr. Manfred Horstmann, Sr. Vice President and General ManagerCleanroom | Electronics | IC Design | Nanoelectronics | NEXT | Packaging | Production | Produktion | Semiconductor
