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Nanoelectronics

GlobalFoundries and NXP: 22FDX next generation solutions for automotive, IoT and smart mobile

Microelectronics

GlobalFoundries and NXP: 22FDX next generation solutions for automotive, IoT and smart mobile

Electronics | Mobility | Nanoelectronics | Semiconductors

The billions foregone and their reasons – Intel and ZF/Wolfspeed “postpone” EU Chips Act projects

Microelectronics

The billions foregone and their reasons – Intel and ZF/Wolfspeed “postpone” EU Chips Act projects

Cleanroom | Electronics | Forschung & Entwicklung | Halbleiter | IC Design | IC Design | Internationalisierung | Internationalization | Nanoelectronics | Packaging | Packaging | Research & Development | Semiconductors | Silicon Saxony | Silicon Saxony | Technological Sovereignty

Fraunhofer IKTS: Bringing complex microelectronic products to market faster and more cost-effectively

Microelectronics

Fraunhofer IKTS: Bringing complex microelectronic products to market faster and more cost-effectively

Electronics | Nanoelectronics | Research & Development | Semiconductors

X-FAB: World’s first integrated value chain platform initiative for heterogeneous integration in photonics

Microelectronics

X-FAB: World’s first integrated value chain platform initiative for heterogeneous integration in photonics

Nanoelectronics | Production | Resilience | Semiconductors | Technological Sovereignty

Fraunhofer IISB: Process chain for power electronic components based on novel semiconductor material aluminum nitride

Microelectronics

Fraunhofer IISB: Process chain for power electronic components based on novel semiconductor material aluminum nitride

Electronics | Nanoelectronics | Research & Development | Semiconductors

Fraunhofer IZM: Soitec launches European project to develop high-frequency semiconductors of the future

Microelectronics

Fraunhofer IZM: Soitec launches European project to develop high-frequency semiconductors of the future

Nanoelectronics | Research & Development | Semiconductors | Technological Sovereignty

TU Dresden: Molecular sponge for the electronics of the future

Microelectronics

TU Dresden: Molecular sponge for the electronics of the future

Electronics | Forschung & Entwicklung | Nanoelectronics | Research & Development | Semiconductor | Semiconductors

Fraunhofer IZM: Partnership with EV Group expanded in wafer bonding for quantum computing applications

Microelectronics

Fraunhofer IZM: Partnership with EV Group expanded in wafer bonding for quantum computing applications

Nanoelectronics | Research & Development | Semiconductors | Technological Sovereignty

$Infrachip project: Supporting researchers in the development of the semiconductor chips of the future$

Microelectronics

Infrachip project: Supporting researchers in the development of the semiconductor chips of the future

Nanoelectronics | Research & Development | Semiconductors | Technological Sovereignty

Infineon: Building permit handed over for final construction phase of Smart Power Fab in Dresden

Microelectronics

Infineon: Building permit handed over for final construction phase of Smart Power Fab in Dresden

Nanoelectronics | Semiconductors | Technological Sovereignty

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