MicroelectronicsBarkhausen Institut: 6G-ICAS4Mobility – Combining communication and radarCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor | Sensors | Track & Trace | Wireless systems
MicroelectronicsBeyond Gravity: Powerful Lynx computer takes data processing to a new levelCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsOkmetic: Okmetic launches Terrace Free SOI capabilityCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsEuropean Council: Chips Act – Council and European Parliament strike provisional dealCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsFraunhofer IPMS: Leveraging Europe’s pilot infrastructure federated quantum technology production facilitiesCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsBosch: Bosch plans to acquire U.S. chipmaker TSI SemiconductorsCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsInfineon: Infineon breaks ground for new plant in DresdenCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
