MAM2026 – Materials for Advanced Metallization Conference

MAM 2026 will be the 33rd conference in a series of conferences dealing with materials, processes, and their integration for the front end and back end in microelectronics.

Starting as a workshop on refractory metals and silicides in the 1980s, the conference has also focused on materials for metallization, memory and memristive devices, 1D/2D nanomaterials, and materials for 2D and 3D packaging since 1995. Another focus is on dedicated characterization and modeling methods in the context of analytics, reliability and failure analysis, and process simulation. The applications are multifaceted and include, for example, CMOS-based microelectronics, power semiconductors, alternative memory technologies, spintronic, neuromorphic and quantum devices, sensors and actuators, 3D integration, and SOC/SIP.

The aim of the conference is to provide a forum for open discussion on basic and applied sciences as well as industrial applications.
It is aimed at scientists, process and integration engineers, R&D managers, and doctoral students.

Keynote presentations and invited talks will be given by scientific and technical leaders in each of the key areas to present the current state-of-the-art and to stimulate technical discussions.