International Conference on IC Design and Technology (ICICDT)

From Integrated Devices to Integrated Chiplets: Design, Device and System Innovation for the Future

The International Conference on IC Design and Technology (ICICDT) serves as a premier global forum for fostering collaboration and innovation across IC design and semiconductor technology domains.

Under the theme "From Integrated Devices to Integrated Chiplets: Design, Device and System Innovation for the Future", the conference emphasizes the critical role of cross-disciplinary integration - spanning design, device, and process engineering - in driving the next wave of semiconductor advancements.

This synergy accelerates the transition from innovative concepts to manufacturable solutions, paving the way for future chiplet-based architectures and system-level breakthroughs.

Call for Paper

The deadline for submissions to the International Conference on IC Design and Technology 2026 is 3 March 2026. The conference provides a platform for cutting-edge international research in areas such as advanced materials, power semiconductors, 2.5D/3D packaging, chiplet integration, 2D semiconductors, digital and analogue circuits, low-power memory, SoC/SiP, MEMS, IoT and AI.

👉 Zum Call for Paper