Chemnitz Seminar »Electronic Packaging and Applications«

The Chemnitz Seminar »Electronic Packaging and Applications« will bring together industry professionals, researchers, and technology leaders to explore the latest developments, challenges, and innovations in electronic packaging.

Seminar Highlights:

• Emerging trends in advanced electronic packaging technologies and heterogenous integration for MEMS, photonic and quantum devices
• Packaging materials and processes for high-performance and reliable systems
• Thermal management aspects and miniaturization strategies
• Applications in automotive, telecommunications, consumer electronics and industrial systems
• Opportunities for collaboration between industry and research institutions

This seminar offers an excellent platform for exchanging knowledge, discussing real-world applications, and identifying future opportunities for collaboration. Participants will gain valuable insights into how advanced packaging solutions enable next-generation electronic systems.

Become an active part in our pitch session:
We offer companies the opportunity to present their project ideas in a three-minute pitch at the end of the first day in order to attract potential cooperation partners. Register now for the event and take part with your pitch!