aCCCess
Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
Launched in March 2025, the four-year EU project aCCCess is building the European Network of Chips Competence Centres (ENCCC) and ensuring maximum synergies between CCCs, Chips Pilot Lines (CPLs) and the virtual Design Platform (DP). Under the leadership of experienced cluster organizations and technology partners, a central platform is being created that accelerates innovation, facilitates access to technology and funding for companies and strengthens Europe’s semiconductor competence on a global level.
The CCCs, CPLs and the DP are key initiatives of the EU Chips Act, driven by the Chips JU. These initiatives provide companies – especially SMEs and start-ups – with essential resources, training and access to state-of-the-art semiconductor infrastructure. While CCCs foster innovation and specialized expertise, CPLs bridge the gap between research and production, and the DP provides a cloud-based environment with advanced design tools to support chip development in Europe.
The consortium consists of 7 experienced partners, including Silicon Saxony, and 15 associated partners operating as Chips Competence Centers (CCCs), Pilot Lines (CPLs) and Design Platforms (DP).
As part of the consortium, Silicon Saxony ensures its members early access to new technologies, best practices as well as funding and networking opportunities.
Profile
Duration: March 2025 – February 2029
Funding program: Digital Europe
Target group: SMEs, large companies, universities and research centers
The advantages at a glance
Strengthen skills
- Access to CCCs, CPLs and DPs
- Faster process with the aCCCess Marketplace
- Early access to new technologies and best practices
Strengthen exchange with experts
- Establishment and support of the “Chips Think Tank”, which highlights the skills of experts and thought leaders at the ENCCC.
- Events to exchange ideas with experts from the CCCs, CPLs and DPs
- Direct networking with relevant stakeholders in terms of exchange and cooperation
Strengthen financing options
- Connection to the Chips Finance Lab: training on financing products from the EIB, EIF, etc.
- Matchmaking with investors
- Direct access to investors for company growth and project funding
- Improved chances of success in financing innovation projects
Numbers. Data. Facts
Selected Chips Competence Centers in 25 countries
Pilot Lines
Design Platform
Project partners
Associated partners
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
