aCCCess
Building a Stronger European Semiconductor Ecosystem Through the European Network of Chip Competence Centers
Launched in March 2025, the four-year EU project aCCCess is establishing the European Network of Chips Competence Centers (ENCCC) and ensuring maximum synergies between CCCs, Chips Pilot Lines (CPLs), and the Virtual Design Platform (DP). Led by experienced cluster organizations and technology partners, a central platform is being created to accelerate innovation, facilitate companies’ access to technologies and funding, and strengthen Europe’s semiconductor expertise on a global scale.
The CCCs, CPLs, and the DP are key initiatives of the EU Chips Act, driven by the Chips JU. These initiatives provide companies—particularly SMEs and startups—with essential resources, training, and access to state-of-the-art semiconductor infrastructure. While CCCs promote innovation and specialized expertise, CPLs bridge the gap between research and production, and the DP provides a cloud-based environment with advanced design tools to support chip development in Europe.
The consortium consists of 7 experienced partners, including Silicon Saxony, as well as 15 associated partners that operate as Chips Competence Centers (CCCs), Pilot Lines (CPLs), and Design Platforms (DPs).
As part of the consortium, Silicon Saxony ensures that its members have early access to new technologies, best practices, and funding and networking opportunities.
Profile
Duration: March 2025 – February 2029
Funding Program: Digital Europe
Target audience: SMEs , large companies, universities, and research centers
An Overview of the Benefits
Strengthen Skills
- Access to CCCs, CPLs, and DPs
- Faster Process with the aCCCess Marketplace
- Early access to new technologies and best practices
Strengthen dialogue with experts
- Establishing and managing the “Chips Think Tank,” which highlights the expertise of experts and thought leaders within the ENCCC.
- Events to exchange ideas with experts from the CCCs, CPLs, and DPs
- Direct networking with relevant stakeholders to facilitate exchange and cooperation
Strengthen Financing Options
- Connection to the Chips Finance Lab: Training sessions on financing products from the EIB, EIF, etc.
- Matchmaking with Investors
- Direct access to investors to support business growth and project funding
- Improved Chances of Success in Financing Innovation Projects
Numbers. Data. Facts
Selected Chips Competence Centers in 28 countries
Pilot Lines
Design Platform
Project Partners
Associate Partners
With support from
aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No. 101217840.
