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RENA Technologies GmbH

Company type

Large companies (>250 employees or >50 million annual sales)

Target markets

Electronics·Infrastructure·Machinery and Equipment

Industries

Machinery & Equipment·Materials·Production·Technology

Portfolio

Semiconductor

Certificates

About this member

RENA Technologies GmbH

The art of wet processing.


RENA stands for cleanroom equipment, wet chemistry and automation - the three core competencies of the company.
Together with customers from all areas of the semiconductor, medical technology, renewable energy, glass and additive manufacturing industries, RENA Technologies develops pioneering solutions for the manufacture of high-quality machines for wet chemical surface treatment.

RENA's equipment is used to treat or modify surfaces, for example semiconductor wafers, solar cells, glass, optical substrates, 3D printed metal components and other high-tech products, using wet chemical processes. RENA offers proven machines as well as customer-specific solutions and process support. The company supplies versatile solutions for series production or special systems for research and development.

Innovative solutions in the field of wet chemical processes for the production of semiconductors

RENA Technologies GmbH presents a wide range of products for the wet chemical processing of wafers for semiconductor production. Our range includes manual, semi-automatic and fully automatic equipment as well as customized chemistry stations with excellent process control. In addition, we offer patented technologies for wet processes such as metal etching and metal lift-off. RENA's flexible platforms and technologies for wet chemical surface treatment are used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing for the manufacture of integrated circuits (IC), MEMS sensors, photonic, RF and power devices.

Our semiconductor surface treatment equipment is capable of processing a variety of semiconductors and compounds such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP) with wafer sizes up to 300 mm. In addition, RENA offers electroplating platforms that enable customers to coat various pure metals such as gold (Au), silver (Ag), copper (Cu) and nickel (Ni) as well as alloys.

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