Microelectronics

Infineon: Signs Supply Agreement with Wolfspeed for 200-mm Silicon Carbide Wafers

October 15, 2026. Infineon Technologies AG and Wolfspeed have signed a new multi-year supply agreement for 200-mm silicon carbide (SiC) wafers. This agreement marks the transition of the existing supply relationship with Wolfspeed from 150-mm to 200-mm substrate technology. SiC semiconductors have become a key technology for applications that drive global decarbonization, ranging from electric vehicles and renewable energy systems to the power supply for AI data centers. The agreement supports Infineon’s transition to 200-mm SiC manufacturing, strengthens the company’s position as a global leader in power semiconductors, and reinforces the resilience of the supply chain as well as the company’s SiC growth strategy.

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Representative image of a semiconductor / Photo by Vishnu Mohanan on Unsplash

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“Silicon carbide is at the heart of the energy transition. Ensuring a reliable supply of high-quality 200-mm substrates is crucial to fulfilling our long-term commitments to our customers,” says Alexander Gorski, Chief Operations Officer at Infineon. “The agreement expands our established supplier base for high-volume 200-mm production and builds on a 20-year supply relationship between our two companies. It strengthens supply security for our customers and provides additional flexibility and scalability to support Infineon’s future growth.”  

AI data centers are increasingly becoming a major driver of demand for SiC power semiconductors. The efficiency of power conversion throughout the entire data center power supply chain is a key cost factor for hyperscalers operating large-scale infrastructures. Due to its switching efficiency and thermal properties, SiC is particularly well-suited for certain power conversion stages where silicon reaches its practical limits. Together with the growing adoption of SiC in electric vehicle powertrains, solar inverters, and industrial motor controls, these developments support the positive long-term outlook for high-quality 200-mm SiC substrates. 

The transition to 200-mm SiC wafers offers significant economic advantages over 150-mm production. The larger wafer diameter increases the usable chip area per wafer, reduces the unit cost of the substrate, and improves overall manufacturing efficiency. Infineon pursues a multi-sourcing strategy for SiC substrates to ensure flexibility and quality in the supply chain within its global production network. This includes the company’s state-of-the-art 200-mm SiC fab in Kulim, Malaysia, which is designed to be the world’s largest and most competitive silicon carbide production facility.

About Infineon 

Infineon Technologies AG is a global leader in semiconductor solutions for power systems and the Internet of Things (IoT). With its products and solutions, Infineon is driving decarbonization and digitalization. The company has approximately 57,000 employees worldwide (as of the end of September 2025) and generated revenue of approximately 14.7 billion euros in fiscal year 2025 (ending in September).

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👉 www.infineon.com  

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Contact info

Silicon Saxony

Marketing, Kommunikation und Öffentlichkeitsarbeit

Manfred-von-Ardenne-Ring 20 F

Telefon: +49 351 8925 886

redaktion@silicon-saxony.de