May 21, 2024: In a joint development project lasting around one year, important progress was made in the production of smart power technologies. Fraunhofer IPMS provided significant support to the semiconductor manufacturer Infineon by supplying selected process modules within the entire CMOS process value chain on 300 mm wafers.
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The collaboration played a key role in the process development for the factory expansion at Infineon Dresden. Over 2000 wafers were successfully processed as part of this collaboration. The wafers were exchanged several times between Fraunhofer IPMS and Infineon Dresden to ensure optimal use of resources and optimum integration into the production lines.
“The results of this joint project are extremely promising and mark a significant step forward for the production of smart power technologies at Infineon Dresden,” commented project manager Andreas Thamm from Infineon. “The close collaboration and the provision of process modules by Fraunhofer IPMS have enabled us to move ahead with the process transfer to 300mm equipment, which is necessary to expand our manufacturing capacity, faster than planned.”
The successful implementation of this project underlines the technological expertise and effective collaboration between Fraunhofer IPMS and its cooperation partners. The fact that several joint projects have already been completed with semiconductor expert Infineon proved to be valuable: “We have been working together for years,” confirms IPMS project manager Dr. Malte Czernohorsky. “In this project, Fraunhofer experts worked closely with colleagues from Infineon. The teams are now well attuned to each other. The collaboration was always results-oriented and our colleagues at Infineon were very open to our ideas,” praises Czernohorsky. “Based on the positive experiences from previous years, we are already thinking about follow-up projects.”
This milestone and the expansion of capacities in the Smart Power Fab area illustrate Infineon’s continuous efforts to further strengthen its position as a leading supplier of high-performance circuits, particularly at the Dresden site. With the construction of the new Smart Power Fab, Infineon is making one of the largest single investments in its history. The aim of the semiconductor manufacturer is to increase the speed at which it expands its semiconductor production capacities and to further strengthen Europe as a chip manufacturing location. This is an important contribution to meeting the growing global demand for semiconductors – for example for applications to generate renewable energy, for use in data centers and for electromobility.
Infineon’s work is being funded by the European Union, the German Federal Ministry for Economic Affairs and Climate Protection and the Free State of Saxony as part of an Important Projects of Common European Interest (IPCEI) in the fields of microelectronics and communication technologies. The funding supports the development of future-oriented, innovative microelectronics and communication technologies up to market maturity. The aim is to complete the European value chain, contribute to European technology sovereignty and promote climate protection through energy-efficient technologies and processes.
Infineon Technologies AG is a leading global provider of semiconductor solutions for power systems and the Internet of Things (IoT). With its products and solutions, Infineon is driving decarbonization and digitalization. The company has around 58,600 employees worldwide and generated revenue of around €16.3 billion in the 2023 financial year (end of September). Infineon is listed in Frankfurt under the symbol “IFX” and in the USA on the over-the-counter market OTCQX International under the symbol “IFNNY”.
The Fraunhofer Institute for Photonic Microsystems IPMS is a leader in applied research and development in the fields of intelligent industrial solutions, medical technology and mobility. Fraunhofer IPMS works on electronic, mechanical and optical components and their integration into miniaturized devices and systems. Its services range from design and product development to pilot production in its own laboratories and clean rooms. With the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS offers applied research on 300 mm wafers for microchip producers, suppliers, device manufacturers and R&E partners.
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