MicroelectronicsGlobalFoundries: “It was hard to find women role models in Engineering.”Cleanroom | Education & Training | Electronics | IC Design | Manufacturing | Nanoelectronics | New Work | Packaging | Recruiting | Semiconductor
MicroelectronicsOkmetic: Silicon wafer manufacturer Okmetic invests nearly 400 million euros to build a new fab in FinlandCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsGlobalFoundries: STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in FranceCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsNXP: NXP Collaborates with Foxconn on Next Generation Vehicle PlatformsCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsRoodMicrotec: RoodMicrotec and Rohde & Schwarz extend longstanding partnership in ASIC developmentCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsJenoptik: Groundbreaking ceremony for the new high-tech fab in DresdenCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor | Sensors | Track & Trace
MicroelectronicsFraunhofer IISB: YESvGaN project develops competitive GaN process technologiesCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsComputing trends: quantum computers, neuromorphic computers and tap-proof telephonyArtificial Intelligence | Cleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsBosch: Bosch readies itself for rising demand for specialty semiconductorsCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
MicroelectronicsFraunhofer IPMS: Semiconductor technology for everyone – services in the 200/300 mm semiconductor areaCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor