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Microelectronics

X-FAB: Collaboration with IHP to Progress SiGe BiCMOS Technology

Microelectronics

X-FAB: Collaboration with IHP to Progress SiGe BiCMOS Technology

Cleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor

Fraunhofer IZM: 360° real-time capture – Using 3D radar sensors to drive autonomously without blind spots

Microelectronics

Fraunhofer IZM: 360° real-time capture – Using 3D radar sensors to drive autonomously without blind spots

Cleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor

Fraunhofer IZM: Fraunhofer, collaborated with Marelli in the development of a pure SiC inverter module for high-performance electric drives

Microelectronics

Fraunhofer IZM: Fraunhofer, collaborated with Marelli in the development of a pure SiC inverter module for high-performance electric drives

Cleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor

Fraunhofer and IBM: Fraunhofer launches quantum computing research platform in Germany

Microelectronics

Fraunhofer and IBM: Fraunhofer launches quantum computing research platform in Germany

Cleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor

Fraunhofer IPMS: “Velektronik” research project creates platform for trusted electronics

Microelectronics

Fraunhofer IPMS: “Velektronik” research project creates platform for trusted electronics

Cleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor

Fraunhofer IPMS: Economical wireless communication

Microelectronics

Fraunhofer IPMS: Economical wireless communication

Cleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor | Wireless systems

Bosch: Bosch opens wafer fab of the future in Dresden

Microelectronics

Bosch: Bosch opens wafer fab of the future in Dresden

Cleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor

Microelectronics

Globalfoundries: Construction of a new factory in the USA – Saxony site also to be expanded

Cleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor

X-FAB: Analog/Mixed-Signal Reference Design Kit for Siemens’ Tanner IC Design Tools

Microelectronics

X-FAB: Analog/Mixed-Signal Reference Design Kit for Siemens’ Tanner IC Design Tools

Cleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor

Infineon: Revolutionizing augmented reality with new MEMS scanner for eyeglasses and head-up displays

Microelectronics

Infineon: Revolutionizing augmented reality with new MEMS scanner for eyeglasses and head-up displays

Cleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor

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