The photonixFAB consortium consists of major public and private companies and highly respected research institutes, all focused on the development and production of next-generation silicon photonics. These high-profile partners include technology and manufacturing service providers LIGENTEC, SMART Photonics, PHIX Photonics Assembly and Luceda Photonics, as well as application developers Nokia, NVIDIA, Aryballe, Brolis Sensor Technology and PhotonFirst, and major research institutions CEA-Leti and IMEC.
Their goal is to build a European value chain for photonic devices and initial industrial manufacturing capabilities. This will pave the way for innovative product developers to achieve scalable large-scale production.
photonixFAB will cover a comprehensive range of photonics foundry and assembly capabilities. These include:
- Industrial-scale silicon photonics manufacturing services with low barriers to entry and short lead times for low-loss SiN- and SOI-based PICs.
- Enabling micro-transfer printing and direct-bonding technologies for heterogeneous integration of InP-, LNO- and germanium-based active and passive components on SiN- and SOI-based PIC platforms.
- Development of scalable packaging and test solutions in coordination with the developments of the (heterogeneous) PIC platforms.
- Process design kit-based design automation for the photonic platforms.
The project will build six demonstrators to validate the implemented photonic value chains. These include applications such as data transmission and optical switches, coherent optical transceivers, IR spectrometers for sensing, digital odor sensors for healthcare, and a demonstrator for health monitoring.
A wide range of applications have already been identified for the state-of-the-art photonic devices fabricated under the photonixFAB project. These include data communications, telecommunications, biomedical sensors/detectors, quantum computing, and vehicle LiDAR.
“Given the enormous potential that is emerging, traditional semiconductor manufacturers, OEMs and start-ups are all now exploring photonics-based applications,” said Rudi De Winter, CEO of X-FAB. “It is therefore the right time for companies to work together to build a comprehensive, Europe-centric silicon photonics ecosystem that will help strengthen the continent’s competitiveness in this exciting new market.”
The project is supported by the Joint Undertaking for Key Digital Technologies (KDT JU) and funded by the EU and national authorities. Together with the direct investments of the individual consortium members, the total funding amounts to 47.6 million euros. Much of the work under this 3.5-year project will be carried out at X-FAB’s foundry in Corbeil-Essonnes, France; additional activities will also be carried out at the partners’ numerous other sites throughout Europe.
Acronyms
InP – Indium Phosphide
IR – Infrared
LiDAR – Light Detection and Remote Sensing
LNO – Lithium Niobate on Insulator
PIC – Photonic Integrated Circuit
SiN – Silicon Nitride
SME – Small and Medium Enterprises
SOI – Silicon on Insulator
About X-FAB
X-FAB is the leading analog/mixed signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions using X-FAB’s modular CMOS and SOI processes in geometries from 1.0 µm to 110 nm, as well as its specialized silicon carbide and long-life MEMS processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and microelectromechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the United States. X-FAB employs approximately 4,200 people worldwide.
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Further links
👉 www.xfab.com
Graphic: X-FAB
