Semi und Barkhausen Institut: European Semi Award honors Prof. Fettweis for chip industry contributions
The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit for their pivotal contributions in the fields of telecommunications and nanotechnology. The award winners’ pioneering research and collaboration with academia and industry led to major advances in semiconductor technologies and their market adoption.
The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit for their pivotal contributions in the fields of telecommunications and nanotechnology. The award winners’ pioneering research and collaboration with academia and industry led to major advances in semiconductor technologies and their market adoption.
The European SEMI Award, established 32 years ago, recognizes key players in the global manufacturing supply chain for their leadership excellence and strategic contributions that helped drive critical advances in the microelectronics industry. 2019 SEMI European Award Winners
Willy Sansen, Professor in Engineering Science at the Catholic University of Leuven (KU Leuven) and Gerhard Fettweis, Managing Director of Barkhausen Institut and Professor in Communications Engineering at the Technical University of Dresden (TU Dresden), made outstanding research contributions in analog design and digital design techniques for a wide variety of applications.