“Siemens is pleased to partner with TSMC to offer EDA technologies that provide customers with a growing number of design options, even as time, cost and design complexity pressures continue to increase,” said Mike Ellow, executive vice president, Electronic Design Automation, Siemens Digital Industries Software. “The combination of Siemens’ industry-leading IC design solutions and TSMC’s leading process and advanced packaging technologies enables our many joint customers to realize truly remarkable and industry-changing innovations.”
Siemens’ Calibre® nmPlatform, the industry-leading tool for IC verification, is now certified for TSMC’s N2 process. Siemens toolsets included in this platform and now N2-certified include Siemens’ Calibre® nmDRC software, Calibre® nmLVS software, Calibre® Pattern Matching software and Calibre® PERC™ software toolsets – all now available to early adopters of TSMC’s innovative technology.
Siemens’ Analog FastSPICE platform for circuit testing of nanometer-scale analog, RF, mixed-signal, memory and custom digital circuits recently received TSMC certification for the foundry’s advanced N3P, N2 and N2P processes. As part of the Custom Design Reference Flow (CDRF) for TSMC’s N2 processes, Siemens’ Analog FastSPICE platform now also supports TSMC’s Reliability-Aware simulation technology, which accounts for IC aging and real-time self-heating effects, among other advanced reliability features. The CDRF for TSMC’s N2 technology also includes Siemens’ Solido™ design environment software for advanced variant-aware verification at high sigma.
In the 3D IC space, Siemens and TSMC have successfully collaborated to certify support of Siemens’ Calibre® 3DSTACK solution for the foundry’s latest 3Dblox standard. This certification continues the partners’ ongoing collaboration on thermal analysis requirements for TSMC’s 3DFabric advanced packaging technologies.
In addition, the companies have worked together to unlock the full potential of Siemens’ Tessent™ software for 3D IC design-for-test (DFT) implementations for the benefit of TSMC ecosystem customers and partners at advanced nodes. TSMC and Siemens are working together to develop new 3D DFT methodologies, including known good die (KGD) loopback testing and physical awareness die-to-die failure testing and diagnostics, by leveraging the 3Dblox standard to address the unique IC test and diagnostic challenges encountered at 2nm geometries and below.
“Siemens is a long-standing, strategic partner and is increasing its value to the TSMC Open Innovation Platform® (OIP) ecosystem by offering more high-value solutions to support our latest leading-edge technologies,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “We look forward to even more innovation as we continue to expand our strong and highly valued partnership that helps our customers extend their leadership in HPC and AI by bringing even more differentiated semiconductor designs to market.”
Siemens Digital Industries Software helps organizations of all sizes digitally transform with software, hardware and services from the Siemens Xcelerator Business Platform. Siemens’ software and comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into sustainable products of the future. From chip to complete system, from product to process, across all industries. Siemens Digital Industries Software- Acceleration
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Further links
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Photo: Siemens
