X-FAB: LIGENTEC and X-FAB expand their offering in the field of integrated photonics with SOI and thin-film lithium niobate volume scaling

As part of this expansion, the partners will jointly bring X-FAB’s XPH90 silicon photonics (SOI) technology to market by integrating it into LIGENTEC’s broader photonics platform portfolio, creating a unified ecosystem that includes both SOI and established low-loss silicon nitride (SiN) technologies. LIGENTEC will act as the primary customer interface, providing an optimized and coherent entry point for both high-bandwidth SOI solutions and its established low-loss silicon nitride (SiN) platform.

Together, these platforms cover a wide range of application requirements, from high-speed data communications and high-volume telecommunications to advanced computing, quantum and sensor systems. SiN technology continues to gain significant traction and expand its capabilities in multiple markets, while SOI adds a dedicated solution for bandwidth and integration-oriented datacom and telecom applications.

A central pillar of the collaboration is the industrialization of heterogeneous integration technologies across the SiN and SOI platforms, focusing on the integration of key active and passive devices such as lasers, optical amplifiers, high-speed modulators and photodetectors. A particular focus will be on thin-film lithium niobate (TFLN) technologies that enable advanced electro-optical functions for high-performance next-generation communication and signal processing systems.

To support this vision, the partners will invest in scaling high-speed TFLN-on-SiN and TFLN-on-SOI within the X-FAB foundry ecosystem to 200mm wafer technologies. This move supports a clear path from advanced R&D to industrial scale production and strengthens Europe’s position in next-generation photonic integration.

Through this unified go-to-market approach, customers will benefit from a broader and more coherent technology portfolio, early system and application level integration and a reliable transition from prototyping to volume production. The collaboration strengthens the partners’ ambition to build a robust industrial-scale supply chain for integrated photonic technologies.

“Our collaboration with LIGENTEC to jointly develop and commercialize XPH90-SOI technology together with their low-loss silicon nitride platform is a strong response to the market’s need for versatile, scalable photonics,” said Rudi De Winter, CEO of X-FAB. “By advancing this heterogeneous integration, particularly with thin film lithium niobate, we are providing the essential building blocks for quantum computing and the next generation of telecom and datacom systems. This collaboration underscores our commitment to developing a robust industrial supply chain for photonics in Europe.”

“Our goal has always been to enable a seamless transition from prototyping to volume production,” said Thomas Hessler, CEO of LIGENTEC. “By expanding our partnership with X-FAB, we are providing our customers with early access to a broader technology offering that now includes X-FAB’s XPH90 silicon photonics (SOI) technology and high-volume lithium niobate thin film (TFLN) integration. This technology enables leading-edge performance and helps our partners stay at the forefront of innovation in sensing, connectivity and computing applications.”

Glossary

PIC – Photonic Integrated Circuit
SiN – Silicon Nitride
SOI – Silicon on Insulator
TFLN – Thin FilmLithium niobate

About LIGENTEC SA

LIGENTEC, headquartered in Switzerland, is a leading provider of advanced photonic integrated circuit (PIC) technologies, offering high performance silicon nitride (SiN) and silicon-on-insulator (SOI) platforms with heterogeneous integration of thin film lithium niobate (TFLN) and III-V materials. Through its industrial process design house model, LIGENTEC offers a scalable path from design to volume production for quantum technologies, optical communication and precision sensors. The company operates subsidiaries in France and Belgium and is ISO 9001:2015 certified.

About X-FAB

X-FAB is a global foundry group that provides a comprehensive range of specialty technologies and design IP to enable its customers to develop world-leading semiconductor products manufactured in X-FAB’s six wafer fabs in Malaysia, Germany, France and the United States. With expertise in analog/mixed-signal technologies, microsystems/MEMS, photonics, silicon carbide (SiC) and gallium nitride (GaN), X-FAB is the development and manufacturing partner for its customers, who are primarily active in the automotive, industrial and medical end markets. X-FAB employs around 4,500 people and has been listed on Euronext Paris (XFAB) since April 2017. 

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Further links

👉 www.xfab.com 

Photo: X-FAB