MicroelectronicsBosch: Bosch opens wafer fab of the future in DresdenCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
Smart SystemsFraunhofer ENAS: Best Paper Award winner of Smart Systems Integration Conference SSI2021 selectedArtificial Intelligence | Automation | Big Data | Blockchain | Cleanroom | Cloud | Data Security | Digital Twins | Digitization | Edge Computing | Education & Training | Electronics | IC Design | Industrial Internet of Things | IT | Machinery & Plant Engineering | Manufacturing | Mixed Reality | Nanoelectronics | Neuromorphic Computing | New Work | Packaging | Process Technologies | Quantum Computing | Recruiting | Research & Development | Robotics | Semiconductor | Sensors | Software Development | Track & Trace
MicroelectronicsGlobalfoundries: Construction of a new factory in the USA – Saxony site also to be expandedCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
SoftwareEuropean Commission: Commission kick-starts alliances for Semiconductors and industrial cloud technologiesBig Data | Blockchain | Cleanroom | Cloud | Data Security | Digital Twins | Digitization | Edge Computing | Electronics | IC Design | Industrial Internet of Things | IT | Machinery & Plant Engineering | Manufacturing | Mixed Reality | Nanoelectronics | Neuromorphic Computing | Packaging | Process Technologies | Quantum Computing | Semiconductor | Software Development
Smart SystemsFraunhofer IPMS: Stable European industry-scale fabrication value chains for solid-state-based quantum computer developmentCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsX-FAB: Analog/Mixed-Signal Reference Design Kit for Siemens’ Tanner IC Design ToolsCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
Smart SystemsFraunhofer IIS: Energy-efficient AI chips for atrial fibrillation detectionArtificial Intelligence | Cleanroom | Ecology & Energy Transition | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor | Sustainability
MicroelectronicsInfineon: Revolutionizing augmented reality with new MEMS scanner for eyeglasses and head-up displaysCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
Smart SystemsFraunhofer IISB: Newly developed, unique XRT tool to revolutionize semiconductor material defect characterization techniquesCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsX-FAB: LIGENTEC and X-FAB collaboration creates Europe’s largest capacity foundry service for integrated photonic circuitsCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
