MicroelectronicsBosch: Milestone on the way to opening new wafer fab in DresdenCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Semiconductor
EntrepreneurshipEuropaen Commission: Europe’s Digital Decade – Commission sets the course towards a digitally empowered Europe by 2030Artificial Intelligence | Automation | Big Data | Blockchain | Cleanroom | Cloud | Data Security | Digital Twins | Digitization | Ecology & Energy Transition | Edge Computing | Education & Training | Electronics | Funding | IC Design | Industrial Internet of Things | IT | Machinery & Plant Engineering | Manufacturing | Mixed Reality | Nanoelectronics | Neuromorphic Computing | New Work | Packaging | Process Technologies | Quantum Computing | Recruiting | Research & Development | Robotics | Semiconductor | Sensors | Software Development | Sustainability | Track & Trace | Wireless systems
SoftwareIntel: Transparency and Security Assurance Drive PreferenceAutomation | Big Data | Blockchain | Cleanroom | Cloud | Data Security | Digital Twins | Digitization | Ecology & Energy Transition | Edge Computing | Electronics | IC Design | Industrial Internet of Things | IT | Machinery & Plant Engineering | Manufacturing | Mixed Reality | Nanoelectronics | Neuromorphic Computing | Packaging | Process Technologies | Quantum Computing | Research & Development | Robotics | Semiconductor | Sensors | Software Development | Sustainability | Track & Trace | Wireless systems
MicroelectronicsIntel: Intel’s Cryoprober for Quantum Research is Unlike Any Other ToolCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsX-FAB: Collaboration with IHP to Progress SiGe BiCMOS TechnologyCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer IZM: 360° real-time capture – Using 3D radar sensors to drive autonomously without blind spotsCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer IZM: Fraunhofer, collaborated with Marelli in the development of a pure SiC inverter module for high-performance electric drivesCleanroom | Electronics | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer and IBM: Fraunhofer launches quantum computing research platform in GermanyCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer IPMS: “Velektronik” research project creates platform for trusted electronicsCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor
MicroelectronicsFraunhofer IPMS: Economical wireless communicationCleanroom | Electronics | Funding | IC Design | Manufacturing | Nanoelectronics | Packaging | Research & Development | Semiconductor | Wireless systems