izmo Technologies GmbH

izmomicro: custom SiP & IC Packaging for  high-density, high-performance systems

Wide range of packaging options to accommodate diverse design specifications and functional requirements, including complex mixed-technology assemblies.              
Meet izmo microsystems, the hi-tech semiconductor and systems company specializing in System-in-Package (SiP) miniaturization, with India based facilities for 3D packaging.   

Innovation, Performance, Miniaturization

Performance-Centric Approach

Utilizing the latest in die-attach methods, wire bonding, and flip-chip technologies, we ensure optimal electrical and thermal performance. 

Our packages are designed to minimize parasitics and maximize heat dissipation, ensuring superior performance even in the most rigorous conditions.
          

Form Factor Optimization

With a focus on miniaturization, izmo micro’s SiP solutions enable significant reductions in PCB real estate. 

We offer compact form factors without sacrificing functionality for developing sleeker, more portable devices, giving our clients a competitive edge in their markets.
 

Speed to Market

Our streamlined design and rapid prototyping capabilities enable accelerated development processes, from initial concept to full-scale production. 

By integrating multiple functionalities into a single SiP solution, we help customers achieve faster time-to-market, staying ahead of rapidly evolving technology trends.