Infineon: Infineon introduces XENSIV™ TLE4978: Hybrid current sensor combines ultra-low noise with 9 MHz bandwidth

Artificial intelligence is changing the computing infrastructure, and electromobility is reshaping the transportation sector – power supply systems are facing unprecedented demands for efficiency, speed and precision. Modern silicon carbide (SiC) and gallium nitride (GaN) platforms are switching at ever higher frequencies, requiring current sensor solutions that offer both speed and accuracy without compromise.

The TLE4978 meets this challenge with a patented hybrid Hall and coil design. The architecture integrates differential Hall sensing elements with monolithic differential air coils similar to a Rogowski coil in a single die. Hall elements sense magnetic fields generated by electric current at lower frequencies (DC to a few kHz), while the coil elements respond quickly to changing currents and deliver high bandwidth. This innovative approach delivers 9 MHz bandwidth at 38 mA rms noise and high accuracy, characterized by ±1.2 percent sensitivity error and ±200 mA offset error over temperature and lifetime (-40 °C to 150 °C).

The device’s 9 MHz bandwidth supports fast switching currents in next-generation SiC and GaN platforms. Proprietary shielding techniques provide robust common-mode transient immunity (CMTI) and ensure reliable operation in electrically noisy environments. The sensor enables calibration-free operation, which simplifies system integration and reduces time-to-market.

Advanced protection features include fast overcurrent detection (OCD) with 100 ns response time. OCD thresholds can be configured via the Digital Configuration and Diagnostic Interface (DCDI) or an external resistive voltage divider. The TLE4978 is the first coreless magnetic current sensor with integrated Zero Crossing Detection (ZCD), which simplifies the implementation of control loops. The sensor is housed in an industry standard DSO 16-300 mil package with reinforced and basic isolation, 8 mm clearance and creepage. A low current rail resistance of 550 µΩ enables measurements up to 60 A nominal current. With ISO 26262 capability up to ASIL-B and AEC Q100 Grade 0 qualification, the device meets strict automotive requirements.

Paving the way for the power system infrastructure of tomorrow

The TLE4978 addresses critical requirements in several high-growth segments. In automotive applications, the sensor supports on-board chargers and high-voltage DC-DC converters that enable faster charging and greater range. In renewable energy systems, it improves the efficiency and reliability of photovoltaic (PV) inverters. For AI data centers, where power demand is growing exponentially, the combination of high bandwidth and robust CMTI makes the TLE4978 ideal for next-generation power supply units (PSUs). Precise power sensing enables advanced power management strategies that maximize energy efficiency while ensuring system protection. As data centers scale for AI workloads, every percentage point of efficiency improvement leads to significant cost savings and reduced environmental impact.

The XENSIV sensor portfolio around the TLE4978 family is optimized for use with Infineon’s broad power supply portfolio for AI servers – from the power grid to the processor. The portfolio includes solid-state transformers and solid-state circuit breakers, high-voltage and intermediate bus conversion as well as power modules for DC conversion. Infineon utilizes the advantages of silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) to achieve the highest efficiency, density and robustness. In addition, the company offers its customers a clear path to end-to-end power architectures with proven, high-quality components, consistent design support and scalable performance for AI server platforms of the future.

Availability

Samples of the XENSIV-TLE4978 family are available now. Infineon offers the following evaluation board variants: TLE4978 EVAL 40 A, TLE4978 EVAL 50 A and TLE4978 EVAL 60 A. Further information is available at www.infineon.com/current-sensors.

APEC 2026

Visit Infineon at APEC 2026 from March 22-26, 2026 at the Henry B. Gonzalez Convention Center in San Antonio, Texas. You can find Infineon at booth number 1619 and learn about one of the industry’s broadest portfolios of power semiconductors, featuring all relevant technologies in silicon (Si), silicon carbide (SiC) and gallium nitride (GaN). For press inquiries, please contact media.relations@infineon.com.

Infineon AI Days Taiwan

Infineon We Power AI Day is an industry event for business and technology leaders in Taiwan. Together with our ecosystem partners and customers, we explore the latest advances in the field of power technologies. The goal is a sustainable AI infrastructure designed with Infineon’s innovative solutions – from grid to core. The event will take place on March 31 in Taipei.

_ _ _ _ _ _
About Infineon

Infineon Technologies AG is a leading global provider of semiconductor solutions for power systems and the Internet of Things (IoT). With its products and solutions, Infineon is driving decarbonization and digitalization. The company has around 57,000 employees worldwide (end of September 2025) and generated revenue of around €14.7 billion in the 2025 financial year (end of September). Infineon is listed in Frankfurt under the symbol “IFX” and in the USA on the OTCQX International over-the-counter market under the symbol “IFNNY”.

_ _ _ _ _ _
Further links

👉 To the Infineon website

👉 To the original announcement

This news was translated automatically.