In order to realize these advantages, CEASAX is developing key technologies for the next generation of chips. A particular focus is on functional interposers for high-density integration as well as on state-of-the-art packaging technologies that enable the highest connection densities and lowest packaging heights. These technologies are essential for the integration of modular chiplets, which are combined in complex systems to increase their efficiency and flexibility.
These technological developments are based on an infrastructure that is unique in Europe: CEASAX, funded by the Free State of Saxony and the BMFTR, is the only 300 mm pilot production line in Germany that combines front-end and back-end technologies. It was specially designed for the development and integration of semiconductor and microsystem technologies and offers European industry a powerful research partner. “With 300 mm wafers, CEASAX operates at the level of the international industry standard for wafer production. As a joint initiative of Fraunhofer IPMS and Fraunhofer IZM-ASSID, CEASAX offers a central platform for research and development of large-scale wafer technologies and thus already supports the microelectronics of tomorrow,” says Dr. Wenke Weinreich, one of the heads of CEASAX and division manager at Fraunhofer IPMS.
The innovative strength of CEASAX is based on the close cooperation between two Fraunhofer Institutes:
Fraunhofer IPMS with its Center Nanoelectronic Technologies (CNT) plays a key role in the development of innovative front-end technologies. With its expertise in CMOS processes, device, memory and interconnect technologies, the institute creates the basis for the high-density integration of next-generation chiplet systems and functionalized interposers. An additional focus is on the further development and integration of ferroelectric memory technologies, which are being scaled up for FD-SOI technology in the FAMES pilot line project, coordinated by the French RTO CEA-Leti.
The Fraunhofer IZM-ASSID (Center for All Silicon System Integration Dresden) acts as a technology driver for advanced wafer-level packaging and 2.5D/3D system integration. It takes the leading role in CEASAX for chiplet integration based on advanced interconnect technologies such as hybrid bonding and fine-pitch µBump interconnects using interposer technologies, Si bridges and high-density rewiring technologies. Fraunhofer IZM-ASSID’s end-to-end 200/300 mm process line allows double-sided processing at wafer level and the integration of vertical silicon vias (TSVs). This state-of-the-art infrastructure supports the implementation of complex integration strategies for chiplets and the development of innovative 3D packaging architectures that can be directly transferred to industrial applications.
With this bundled expertise and infrastructure, CEASAX is part of the Research Fab Microelectronics Germany (FMD) and thus of a far-reaching network in the European semiconductor industry. This platform, which is unique in Europe, sustainably strengthens the competitiveness of the German and European semiconductor market and promotes the transfer of scientific excellence into industrial value creation. “Technological sovereignty begins where we not only master the technology, but also shape it. CEASAX is a strong research partner for Europe, Germany and the Free State of Saxony in particular, combining the key technologies of Fraunhofer IPMS and Fraunhofer IZM-ASSID and thus covering the entire semiconductor value chain from front-end to advanced packaging at 300 mm wafer level.”, explains Dr. Manuela Junghähnel, second head of CEASAX and site manager of Fraunhofer IZM-ASSID.
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Further links
👉 www.ipms.fraunhofer.de
Photo: Fraunhofer IZM
