June 16, 2025. Applied Materials, Inc. and CEA-Leti today announced the next phase of their long-standing collaboration to drive innovation in specialty semiconductors. Under a Memorandum of Understanding (MOU), the companies plan to expand their joint lab and develop materials technology solutions to address emerging infrastructure challenges in AI data centers.
Categories
Tags
Contact info
Silicon Saxony
Marketing, Kommunikation und Ă–ffentlichkeitsarbeit
Manfred-von-Ardenne-Ring 20 F
Fax: +49 351 8925 889
Contact person:
The joint lab focuses on device innovations for chip manufacturers serving ICAPS markets (IoT, communications, automotive, energy and sensors). These specialty chips are used in a variety of applications – from industrial automation to electric vehicles – and play a critical role in data management and power distribution in data centers. The growing demand for resources in AI infrastructure has highlighted the need for a new wave of innovation in ICAPS chips to enable more energy-efficient computing.
Under the new agreement, Applied and CEA-Leti plan to expand the lab with new equipment and capabilities that go beyond individual process steps to include the full development of specialty devices. In addition, the lab will be equipped with state-of-the-art packaging tools to support heterogeneous integration of chips across different wafer types and process nodes – enabling entirely new classes of specialty devices for a range of next-generation applications.
The joint facility will feature multiple wafer processing systems from Applied Materials, as well as CEA-Leti’s world-class capabilities for new material performance evaluation and device validation. The modernized lab is expected to strengthen the chip ecosystem in France by further expanding the technology hub in Grenoble, a leading location for joint innovation between government, academia and industry. The lab is also an extension of Applied’s global EPIC platform, a new high-speed innovation model to accelerate the commercialization of new chip technologies. Applied and CEA-Leti will be able to leverage the research and development efforts at Applied’s global innovation centers to drive advancements in specialty semiconductor technologies.
“Applied Materials and CEA-Leti have a long history of successful collaboration, and we are excited to strengthen our capabilities to accelerate innovation and commercialization of next-generation specialty chips,” said Aninda Moitra, corporate vice president and general manager of Applied Materials’ ICAPS business. “Our combined expertise will help achieve breakthroughs and push the boundaries of semiconductor innovation, contributing to sustainable advances in a range of critical applications for the AI era.”
Sébastian Dauvé, CEO of CEA-Leti, said the first phase of the expanded collaboration has laid important groundwork for addressing the materials engineering challenges of specialty semiconductor devices.
“Building on this momentum, the joint lab’s new focus on energy-efficient solutions for AI data center infrastructures reflects our shared commitment to technological advances that meet both industrial and societal needs. The expanded collaboration also leverages our complementary strengths to accelerate system-level innovation while supporting the sustainable growth of the French semiconductor ecosystem,” said DauvĂ©.
Applied Materials, Inc. (Nasdaq: AMAT) is the world’s leading provider of materials technology solutions used in the manufacture of virtually all new chips and advanced displays. Our expertise in modifying materials at the atomic level and on an industrial scale enables our customers to turn possibilities into reality. At Applied Materials, our innovations make a better future possible. For more information, visit www.appliedmaterials.com.
CEA-Leti, a technology research institute of the CEA, is a world leader in miniaturization technologies for smart, energy-efficient and safe solutions for industry. Founded in 1967, CEA-Leti is a pioneer in the field of micro and nanotechnologies, developing customized, differentiated application solutions for global enterprises, SMEs and start-ups. CEA-Leti addresses critical challenges in the fields of healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams provide in-depth expertise and utilize world-class pre-production facilities. With more than 2,000 employees, a portfolio of 3,200 patents, 11,000 square meters of clean room space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley, Brussels and Tokyo. CEA-Leti has founded 75 start-ups and is a member of the Carnot Institute network. Follow us at www.leti-cea.com and @CEA_Leti.
The CEA plays a key role in transferring scientific knowledge and innovation from research to industry. This top-class technological research is carried out in particular in the field of electronic and integrated systems, from microtechnology to nanotechnology. It has diverse industrial applications in transportation, health, security and telecommunications and contributes to the development of high-quality and competitive products.
For more information: www.cea.fr/english
Contact Applied Materials
Ricky Gradwohl (Editorial/Media, USA) +1 408.235.4676
Audrey Pariente (Editorial/Media, Europe) +49 174 336 57 68
Liz Morali (Finance) +1 408.986.7977
– – – – – –
Photo: pixabay
