Sensry GmbH

Sensry – Platform for All Integrated Smart & Secure Sensors

Sensry support customers with sensor nodes with customized high integrated modular systems of sensors, processing units and communication interfaces.
The system components are based on the latest new technologies and manufactured in cooperation with market leaders for volume production and are supported with software development kits.
Sensry got established in 2018 in Dresden Germany the center of microelectronic Europe and has a cooperation with several Fraunhofer institutes for development and GLOBALFOUNDREIES for production.
The first platform is ready for prototyping and volume and the next generation is under development.

Main Product Features
• Integration of various sensors
• Support of multiple communication standards
• Low power consumption
• ARM processor or RISC-V performance for smart node computing
• Adequate memory resources
• Inherent multi-layer data security and authentication
• Very fast design using standard library HW chiplets
• Smallest form factor due to advanced packaging
• Available software toolchain
• Integration in fog and cloud computing

Sensry – One-Stop Shop
• Customized module configuration
• Flexible integration and combination of different sensors
• Software and systems support
• Prototyping, testing, ramp-up and production support
• Complete supply chain support

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Sensry Kallisto® IoT Solution Platform

The Sensry Kallisto® embeds sensing, processing, energy management and radio communications in one monolithic size-optimized PCB module. The PCB module also provides core and an optional part of sensors and power management add-ons to enable a huge variety of IoT applications.

Moreover, the Sensry Kallisto® ecosystem provides a hardware abstraction layer that allow developers to seamlessly interact with the module and its features in order to reduce the development cycle. This includes also OTA updates of the firmware SDK and the user software.

Bluetooth® LE antenna and matching network on-PCB; embedded low power sensors: 16-bit IMU and geomagnetic sensor; optional ambient sensors and wireless charge capability. Firmware and software development tools; Pre-programmed Bluetooth LE protocol stack; over-the-air firmware updates. Designed to be seamlessly integrated in different architectures, to allow for shorter development cycles and stimulate the creation of new IoT solutions.

Key Features
• PCB core module
o Multiprotocol Bluetooth® Low Energy
o Antenna-on-Module
o Low power ARM microcontroller
o Low power 3-axis accelerometer
o Low power 3-axis gyroscope
o Low power 3-axis geomagnetic sensor
o Temperature
o Humidity
o Air Pressure
o Battery fuel gauge
o LiPo charger

• PCB additional sensor & wireless charge module (optional):
o VOC
o Light Sensor
o Wireless Qi Power Receiver
o USB connector for power supply

Target Applications
• Wireless Wearable Technology
• Wireless connected sensors for healthcare,
• sport, fitness and industrial applications
• Wireless for IoT applications
• Wireless connected objects
• Wireless connected presence sensors
• Wireless Home automation
• Beacons

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Sensry Ganymed® IoT Solution Platform

Revolutionized New Platform for All Integrated Smart & Secure Sensors
Next generation applications in logistics, robotics, automation, smart home and building, consumer and white goods, smart city and renewable energy require the adaption of smart and secure sensors with data connectivity. Existing semiconductor standard solutions often provide insufficient flexibility and missing software environment. The most critical item, however, is the missing inherent data security approach encompassing the complete value chain of the product.

The Solution
Sensry a newly established company offers an individual sensor node with highly flexible and customizable hardware configurations according to customer requirements. The universal sensor platform USeP combines cutting-edge assembly and packaging technologies with new design methods as well as various integration possibilities for sensors.

Main Product Features
• Integration of various sensors
• Support of multiple communication standards
• Low power consumption
• RISC-V performance for smart node computing
• Adequate memory resources
• Inherent multi-layer data security and authentication
• Very fast design using standard library HW chiplets
• Smallest form factor due to advanced packaging
• Available software toolchain
• Integration in fog, edge and cloud computing

Key features
• Selection of Top-Level sensors
o Acceleration
o Gyroskope
o Magnetometer
o Vibration
o Temperature
o Pressure
o Humidity
o VOC

• RF tranceiver on Bottom-Level
o 2,4 GHz WiFi Tranceiver
o 2,4 GHz Bluetooth Tranceiver

• Application processor on Mid-Level
o RISC-based multicore, running at max. 400MHz
o RISCY Data acquisition Unit (DAQU)
o 8 RISCY Data Proc. Units (DPU) with FPU
o Event bus
o DMA

• Security features
o Crypto Co-Processor
o Secure Boot ROM
o Secure MRAM / SRAM
o True Random Number Generator (TRNG)
o One-Time-Programmable Memory (OTP) for Keys and Certificates

• Interfaces (Mid-to-Top, Mid-to-Bottom-Level)
o 1 HyperBus (for external RAM/Flash)
o 3 UART (up to 2Mbit/s, two of them with hardware handshake)
o 4 I2C (up to 400kHz)
o 4 I2S
o 7 SPI (up to 50MHz)
o 1 CAN-FD
o 1 RGMII with MDIO for Ethernet-Phy
o Debug JTAG | System JTAG
o 1 25MS/s 12bit SAR ADC
o 1 100kS/s 11bit ultra low power SAR ADC
o 1 16Bit Sigma Delta ADC (Audio)
o 32 GPIO (configurable for 1.8V or 3.3V operation)
o Each interface (except GPIO) can be induvidually disabled for power saving

• Memory
512kB MRAM (256kB Secure MRAM + 256kB MRAM)
4MB SRAM
256kB SRAM for each core in the DPU (Tightly coupled)

Target Applications
• Sensor node for Internet of Things (IoT)
o Home automation
o Sensor networks
o Building automation
o Condition monitoring
o Retro Fitting
o Industrial applications
o AI related applications

• Authentication and security devices
o Identification key
o Secure sensor data harvester
o Secure blockchain wallet

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