3D & Systems Summit 2026

The SEMI 3D and Systems Summit brings together semiconductor packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration.

This year's theme, Enabling Next-Gen Heterogeneous Systems Integration, focuses on exploring geopolitical dynamics, market trends, strategies to advance Europe's next-gen semiconductor solutions, and the latest technological advancements.  

Expert-led sessions cover chiplet architectures, hybrid bonding, co-packaged optics, AI-driven system architectures, AR/VR, and wearable intelligence, with a strong focus on Europe's role in advancing design leadership, materials innovation, and the transition from lab to fab.

The exclusive exhibition area showcases industry leaders alongside innovative emerging companies, providing a platform for gathering and exchanging knowledge and foster collaborations. 

Attendees will have several opportunities for B2B matching, including networking receptions, coffee breaks, lunches, and a unique Networking Dinner Cruise along the beautiful Elbe River.  

WHAT YOU CAN EXPECT

• Three days of focused technical exchange on advanced packaging and heterogeneous integration
• Expert keynotes and panels addressing the industry’s most critical challenges
• Sessions covering chiplet architectures, hybrid bonding, co-packaged optics, AI systems, AR/VR and wearable intelligence
• Exclusive exhibition featuring industry leaders and innovative emerging companies
• B2B matchmaking and networking formats designed to connect you with the right people
• Direct access to engineers, researchers, product leaders and decision-makers
• A unique Networking Dinner Cruise along the Elbe River
• Organised by SEMI Europe, the global industry association for the electronics supply chain

TOPICS
From chiplet architectures and hybrid bonding to co-packaged optics, AI-driven system design, AR/VR, wearable intelligence, and Europe’s semiconductor sovereignty, the 3D & Systems Summit connects deep technical expertise with strategic industry perspectives.

WHO SHOULD ATTEND
Semiconductor packaging engineers, process technologists, system architects, R&D leaders, product managers, researchers, and business decision-makers from across the heterogeneous integration and semiconductor ecosystem.

REGISTRATION
Delegate Ticket Prices:

• SEMI Members: €1,195 (excl. 19% German VAT)
• Non-members: €1,695 (excl. 19% German VAT)

Delegate Ticket Includes:

• Conference sessions and keynote presentations
• Exhibition access
• Coffee breaks and lunches
• Networking Reception (June 17)
• Networking Dinner Cruise (June 18)