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Onto Innovation Germany GmbH

Unternehmensart

Mittlere Unternehmen (<250 Mitarbeiter:innen oder <50 Mio. Jahresumsatz)

Zielmärkte

Elektronik

Branchen

Produktion

Portfolio

Advanced Packaging Lithography·Dünnschicht-Metrologie·Elektronik·Equipment·Equipment Control Software·Halbleiterindustrie·Makroinspektion·Mikro- / Nanoelektronik·optische Inspektion·Process Control Software·Software·Wafer-Inspektion·Yield Management Software

Zertifikate

Über das Mitglied

Onto Innovation stands alone in process control with our unique perspective across the semiconductor value chain. We enable our customers to solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation will optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports its customers with a worldwide sales and service organization.

We combine the scale of a global leader with an expanded portfolio of leading-edge technologies that include: unpatterned wafer quality; 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. The breadth of this portfolio allows us to collaborate with customers about their process yields and process variations from bare silicon wafers through the wafer fab to the final back-end packaging. Onto Innovation’s software brings understanding of how individual processes affect the overall product, enabling customers to improve product quality and reliability.  

Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar.

Inspection Equipment, Measurement Equipment, Defect Inspection, Particle, Bump, Advanced Packaging Metrology and Inspection, Contamination Detection, Review, Die Inspection, Film Thickness, Uniformity Measurement, Ellipsometer, Metal Film Thikness, All Surface Inspection, Factory Monitoring and Control System, Automatic Defect Classification, Process Control, Production Control Software, Yield Management

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