AP&S International GmbH

FULL RANGE OF WET PROCESS SOLUTIONS

We deliver advanced, high-performance wet surface treatment equipment to the industry’s leading semiconductor fabs worldwide. The AP&S wet process range includes manual, semi-automated and fully automated wet process equipment for up to 300mm wafers. The AP&S solutions perfectly cover batch as well as single wafer processing. Etch processes, surface conditioning, resist develop, resist strip, metal lift-off, metal etch, electroless metal deposition, wafer cleaning and drying applications are all included in the AP&S portfolio.

Our hardware is perfectly adapted to the requirements of the microstructuring industry: high throughput, innovative and cost-efficient processing, optimized footprint and most reliable process results are the characteristics of the AP&S wet process equipment.

AP&S offers innovative wet process technologies for wafer processing in the microchip fabrication process, including cleaning, etching, resist strip, resist development, metal etching, electroless metal deposition for Under Bump Metallization, lift-off and wafer drying technologies.

With a wide range of modular wet process equipment using various techniques such as immersion, spin and spray AP&S is well positioned to meet the specific needs of the semiconductor industry.

At the AP&S Demo Center, an in-house laboratory at our German headquarters, we offer wet process demonstrations for wafers, masks and other substrates.