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Cryo chamber for wafer warpage reduction in R&D and wafer fabs
Discover the new Cryo Chamber by Weiss Technik—a stainless‑steel, ISO‑4 cleanroom‑ready system engineered for cryogenic applications in semiconductor labs and fabs. The session walks through core features such as a temperature range down to –75 °C, automatic door for efficient handling, SECS/GEM connectivity, OHT compatibility, and QR‑based batch recognition.
You’ll see how the chamber is deployed in R&D and production environments, how it integrates into existing process flows, and what to consider for safe, ergonomic operation in cleanroom settings.
Agenda
- The Cryo Chamber in detail.
- Realistic lab and fab use cases, integration into MES and overhead handling, throughput and operability considerations.
- Short clips illustrating manual and automatic loading and typical cleanroom operation.
- vötschoven thermal processing solutions for high efficient clean room usage.