Brokerage for Lab to Fab Accelerator projects on Advanced Packaging

The brokerage will take place in conjunction with and is kindly hosted by the Fraunhofer IZM Electronic Packaging Days 2025.

Chips JU will launch calls for Lab to Fab transfer of Advanced Packaging from the Chips JU pilot lines into industry. The goal of the workshop on November 7 is to inform the community about the call content and to initiate consortia building.

The respective call documents will be available here before the event.

Please register here for the workshop until October 24, 2025.

The workshop will take place onsite only. Find us also in a dedicated EPoSS booth!

If you are not able to join, but you are interested in the calls and funding opportunities, please do not hesitate to contact the EPoSS Office via contact@smart-systems-integration.org.