Advanced Packaging Conference (APC)

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency

Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, Material Integration and Power Optimization are just some of the cutting-edge innovations of how Advanced Packaging contributes to these developments.

At this year’s Advanced Packaging Conference (APC), we would like to present the latest advancements and innovations in these fields by bringing together leading experts, innovators, and stakeholders from academia, industry, and government to explore the latest trends, challenges, and breakthroughs.