3D & Systems Summit

Themed Heterogenous Integration: Bolstering Europe's Resilience, the 3D & Systems Summit 2025 will explore strategies for enhancing Europe's semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in heterogeneous integration, chiplet applications, and hybrid bonding techniques. The program features expert sessions, an exclusive exhibition, and professional networking opportunities—including a dinner cruise on the Elbe River.

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