FREE Online Webinar – Laser Annealing: Revolutionizing Sensor and Semiconductor Manufacturing | December 4 | 8:00 – 9:00am PT

3D-Micromac, a leader in high-precision laser-based semiconductor processing and micromachining, has consistently adapted to meet evolving market demands. As the need for greater precision and efficiency in semiconductor and sensor technology grows, traditional production methods began to show their limitations. To address these challenges, 3D-Micromac has applied its laser technology expertise to develop selective laser annealing, offering innovative solutions that enhance both production quality and efficiency while also enabling the creation of entirely new products.

Laser annealing offers a transformative alternative to conventional annealing methods, particularly in the production of Giant Magnetoresistance (GMR) and Tunneling Magnetoresistance (TMR) sensors. Traditional techniques, such as large magnetic annealing furnaces, significantly limit the throughput for complex sensor designs and increase production costs. The furnace approach also introduces potential yield losses due to its inherent processing complexity.

In contrast, selective laser annealing enables heating only illuminated wafer areas and not the entire wafer to provide extremely precise process control and enable closer placement of sensors to logic elements, laying the foundation for an integrated, monolithic sensor design (Fig. 1). This laser-based sensor programming enables a one-step process, eliminating the need for additional production steps such as dicing or chip transfer, which results in higher throughput and reduced costs.

Another semiconductor processing application that benefits from laser annealing is ohmic contact formation, which is a critical and challenging step in manufacturing silicon carbide (SiC)-based power devices. Traditionally, rapid thermal processing (RTP) has been used to generate well-controlled silicide interfaces because of its small thermal budget, but even RTP limitations become evident as SiC devices become thinner. Pulsed laser sources offer extremely small thermal budgets which enable ohmic contact formation on thinned SiC substrates resulting in superior device performance.

Both of these applications have already been successfully implemented in industrial machining solutions by 3D-Micromac. This webinar will provide in-depth insights into the processes and results (Fig. 2), while also exploring potential new applications of selective laser annealing. This innovative approach enhances device quality and streamlines manufacturing, marking a significant shift towards more efficient and cost-effective production methods in the sensor and semiconductor industries.