{"id":547604,"date":"2026-10-28T09:32:27","date_gmt":"2026-10-28T08:32:27","guid":{"rendered":"https:\/\/silicon-saxony.de\/adt-introduces-the-6200-compact-automatic-dicing-saw-live-at-semicon-europa-2026-hall-b1-booth-152\/"},"modified":"2026-10-28T09:32:27","modified_gmt":"2026-10-28T08:32:27","slug":"adt-introduces-the-6200-compact-automatic-dicing-saw-live-at-semicon-europa-2026-hall-b1-booth-152","status":"publish","type":"post","link":"https:\/\/silicon-saxony.de\/en\/adt-introduces-the-6200-compact-automatic-dicing-saw-live-at-semicon-europa-2026-hall-b1-booth-152\/","title":{"rendered":"ADT introduces the 6200 compact automatic dicing saw \u2013 live at SEMICON Europa 2026, Hall B1, Booth 152"},"content":{"rendered":"

High performance. Small footprint. Low cost of ownership.<\/strong><\/p>\n

Advanced Dicing Technologies (ADT) announces the 6200, a compact automatic dicing system for manufacturers, laboratories and universities that need reliable, repeatable dicing without a large footprint or a large investment.<\/p>\n

Precision without the bulk<\/h3>\n

At just 490 mm wide, the 6200 fits where conventional dicing platforms cannot: university cleanrooms, R&D labs and high-volume production floors where every square metre counts. Built on ADT’s proven dicing technology, it delivers accurate cutting, simple operation and dependable performance for workpieces up to 150 mm (6″).<\/p>\n

Automation where it matters<\/h3>\n

The 6200 performs automatic alignment, cutting and kerf check inspection, supported by:<\/p>\n

    \n
  • Automatic vision alignment for consistent, repeatable setup<\/li>\n
  • Non-contact optical sensor for blade wear measurement<\/li>\n
  • 2.2 kW air bearing spindle, 6,000\u201360,000 rpm<\/li>\n
  • 17-inch touch screen with graphical, multilanguage interface<\/li>\n<\/ul>\n

    Options include fragment shape recognition, one-click access to designated inspection locations and a low-magnification camera with a large field of view.<\/p>\n

    One platform, many materials<\/h3>\n

    Silicon wafers, compound semiconductors (GaAs, InP, SiC), MEMS devices, optical components, ceramic and glass substrates, package singulation, sensors and microelectronic devices \u2013 making the 6200 a practical choice for research groups working with diverse materials as well as for production lines focused on singulation.<\/p>\n

    Lower cost of ownership by design<\/h3>\n

    Lower initial investment, long service life with minimal operating costs, high reliability for maximum uptime and low utility consumption.<\/p>\n

    Part of a complete dicing solution<\/h3>\n

    At SEMICON Europa, the 6200 is shown together with the surrounding process equipment:<\/p>\n

      \n
    • ADT 967 \/ 967L Semi-Automatic Wafer Mounter<\/strong> \u2013 bubble-free mounting on all standard dicing tapes, up to 25 % less tape than manual mounting; 200 mm (967) and 300 mm (967L); tabletop design<\/li>\n
    • ADT 977 \/ 977Ls Wafer Cleaner<\/strong> \u2013 rotating cleaning arm with atomizing or high-pressure nozzles, up to 20 stored recipes; 8″ (977) and 12″ \/ 12″\u00d712″ (977Ls)<\/li>\n
    • ADT AR-927 Water Recycling System<\/strong> \u2013 closed loop for dicing saws, ultra-filtration to 0.02 \u00b5m, up to 20 L\/min, 95 % water recycling, self-cleaning filter module<\/li>\n
    • ADT Dicing Blades<\/strong> \u2013 hubless resin, metal-sintered and nickel blades as well as hub blades for silicon, GaAs, ceramic, glass, quartz and sapphire; 100 % quality inspection, customised solutions available<\/li>\n<\/ul>\n

      See it live in Munich<\/h3>\n

      Visitors to SEMICON Europa 2026, co-located with electronica at Messe M\u00fcnchen (November 10\u201313), are invited to see the ADT 6200 in action at Hall B1, Booth 152, and to discuss their application with the ADT team.<\/p>\n

      Availability and contact<\/h3>\n

      The ADT 6200 is available to order now.<\/p>\n

      German Shnaider, DACH Region Sales \u2013 gshnaider@adt-co.com
      Uwe R\u00fcttgers, Sales Representative DACH \u2013 uwe.ruettgers@adt-co.com
      General inquiries: sales@adt-co.com | adt-co.com<\/p>\n","protected":false},"excerpt":{"rendered":"

      Advanced Dicing Technologies (ADT) launches the 6200, a compact automatic dicing system for R&D labs, universities and production floors with limited floor space. Only 490 mm wide, with automatic alignment, cutting and kerf inspection. ADT shows the 6200 together with its complete dicing solution at SEMICON Europa 2026 in Munich, November 10\u201313, Hall B1, Booth 152.<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4818],"tags":[1981,2010,2003,2008,2012,1954,1960],"class_list":["post-547604","post","type-post","status-publish","format-standard","hentry","category-microelectronics","tag-cleanroom","tag-manufacturing","tag-packaging","tag-press-release","tag-process-technologies","tag-research-development","tag-semiconductor"],"acf":[],"yoast_head":"\nADT introduces the 6200 compact automatic dicing saw \u2013 live at SEMICON Europa 2026, Hall B1, Booth 152 - Silicon Saxony<\/title>\n<meta name=\"description\" content=\"Advanced Dicing Technologies introduces the 6200 \u2013 a compact dicing system for silicon, SiC, GaAs, MEMS, optics, ceramic and glass. 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