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“Applied and [Intel] have a decades-long history of close collaboration focused on pushing the boundaries of materials science to advance the semiconductor roadmap,” said [Name], President and CEO of Applied Materials. “Bringing our teams together at the EPIC Center will deepen this partnership and accelerate the innovations in transistors, compounds, and packaging technologies needed to drive the future of AI computing.”<\/p>\n
“The demand for AI computing is driving the need for significant advances in performance, energy efficiency, and packaging. We are focused on delivering these innovations\u2014in close collaboration with partners across the entire ecosystem,” said [Name], CEO of [Company]. “Applied Materials is a key partner, and we look forward to expanding our collaboration at the EPIC Center to accelerate the path from the lab to mass production in the United States.”<\/p>\n
Teams from Applied Materials are working together on next-generation materials, process technologies, and device architectures for advanced logic nodes tailored to AI workloads, and will continue this work at the EPIC Center. The collaboration encompasses both front-end and back-end-of-line developments, including the scaling of interconnect structures. It also includes the development of advanced packaging technologies for Foveros-based 3D stacking, which enable higher interconnect density, improved power delivery, and optimized thermal performance for high-performance computing platforms designed to accelerate new agent-based AI workloads.<\/p>\n
\u201cAs the chip manufacturing roadmap becomes more complex with each process node, accelerating innovation in semiconductor devices, interconnects, and packaging requires closer collaboration between research and development and manufacturing,\u201d said Dr. , president of at Applied Materials. “As a founding partner of the EPIC Center, we look forward to working closely with [the company] to shorten development cycles and bring new technologies to market faster.”<\/p>\n
\u201cAccelerating our research and development to keep pace with the rapid expansion of AI infrastructure is critical to delivering the technology, manufacturing excellence, and foundry services that our foundry customers expect,\u201d said Naga Chandrasekaran, Executive Vice President, Chief Technology and Operations Officer, and General Manager of Foundry. \u201cApplied Materials\u2019 new EPIC Center provides an environment where our teams can collaborate even more closely and quickly to accelerate material development and process innovations.\u201d<\/p>\n
Applied Materials\u2019 new EPIC Center (Equipment and Process Innovation and Commercialization) in , which is scheduled to be operational later this year, was designed from the ground up to drastically reduce the time to commercialization of breakthrough technologies\u2014from the early research phase to mass production. For chip manufacturers, the EPIC Center will provide earlier access to Applied\u2019s R&D portfolio, faster learning cycles, and an accelerated transfer of next-generation technologies into mass production\u2014all within a secure collaborative environment. In addition, the joint innovation programs at the EPIC Center will provide Applied with greater cross-functional visibility to guide R&D investments while increasing R&D productivity and value creation.<\/p>\n
This press release contains forward-looking statements, including statements regarding Applied\u2019s investment and growth strategies, the development of new materials and technologies, industry outlooks and technological requirements, plans and expectations for the EPIC Center, and other statements that are not historical facts. These statements and the assumptions underlying them are subject to risks and uncertainties and do not constitute a guarantee of future performance. Factors that could cause actual results to differ materially from those expressed or implied in such statements include, among others: demand for semiconductors and customers\u2019 technological requirements; the ability to develop new and innovative technologies; the ability to acquire and protect intellectual property rights in key technologies; the ability to achieve the EPIC Center\u2019s objectives; and other risks and uncertainties described in Applied\u2019s filings with the Securities and Exchange Commission, including Applied\u2019s most recent Forms 10-K, 10-Q, and 8-K. All forward-looking statements are based on management\u2019s current estimates, projections, and assumptions, and Applied undertakes no obligation to update them.<\/p>\n
Applied Materials, Inc. (Nasdaq: AMAT) is the market leader in materials technology solutions that form the foundation for virtually every new semiconductor and modern display worldwide. The technology we develop is essential for advancing artificial intelligence and accelerating the commercialization of next-generation chips. At Applied Materials, we push the boundaries of science and engineering to develop material innovations that change the world. <\/p>\n
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\ud83d\udc49 www.appliedmaterials.com<\/a> Photo: unsplash<\/i><\/p>\n","protected":false},"excerpt":{"rendered":" October 6, 2026. Applied Materials, the market leader in materials technology for the semiconductor industry, announced today that it is collaborating with Intel Corporation to accelerate innovation in chip manufacturing for next-generation transistors, interconnect technologies, and advanced packaging technologies. The collaboration will combine the cutting-edge expertise of Applied Materials\u2019 EPIC Center and Intel\u2019s research and development campus to shorten the time to market for advanced semiconductor technologies that are essential for AI computing.<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4818],"tags":[2010,1954,1982,4783],"class_list":["post-546725","post","type-post","status-publish","format-standard","hentry","category-microelectronics","tag-manufacturing","tag-research-development","tag-resilience","tag-semiconductors"],"acf":[],"yoast_head":"\n
\ud83d\udc49 www.intel.com<\/a> <\/p>\n